公开(公告)号：US20210088289A1

公开(公告)日：2021-03-25

申请号：US17111077

申请日：2020-12-03

申请人： DELTA ELECTRONICS, INC.

发明人： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ting-Yuan WU

IPC分类号： F28D15/04 ,  H01L23/427

摘要： A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

公开(公告)号：US20170023308A1

公开(公告)日：2017-01-26

申请号：US15215084

申请日：2016-07-20

申请人： DELTA ELECTRONICS, INC.

发明人： Shih-Lin HUANG ,  Ting-Yuan WU ,  Chiu-Kung CHEN ,  Chun-Lung CHIU

IPC分类号： F28D15/04 ,  F28F13/06 ,  F28F3/00

CPC分类号： F28D15/046 ,  F28D15/0233 ,  F28D2021/0028 ,  F28F3/00 ,  F28F3/022 ,  F28F13/06 ,  F28F2225/04 ,  F28F2255/18

摘要： A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed in the chamber. At least one of a side of the first plate facing the second plate and a side of the second plate facing the first plate is formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.

摘要翻译： 薄型蒸气室包括第一板，第二板和毛细结构。 第二板的周边与第一板的周边连接以形成室。 毛细结构设置在腔室中。 所述第一板的面对所述第二板的一侧中的至少一侧和所述第二板的面向所述第一板的一侧形成有多个支撑结构，所述多个支撑结构包括多个支撑柱和多个支撑板， 蚀刻工艺。

公开(公告)号：US20200064080A1

公开(公告)日：2020-02-27

申请号：US16673212

申请日：2019-11-04

申请人： DELTA ELECTRONICS, INC.

发明人： Shih-Lin HUANG ,  Ting-Yuan WU ,  Chiu-Kung CHEN ,  Chun-Lung CHIU

IPC分类号： F28D15/04 ,  F28F3/00 ,  F28F13/06

摘要： A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. Both of a side of the first plate facing the second plate and a side of the second plate facing the first plate are formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.

公开(公告)号：US20190204015A1

公开(公告)日：2019-07-04

申请号：US16144288

申请日：2018-09-27

申请人： DELTA ELECTRONICS, INC.

发明人： Shih-Lin HUANG ,  Ting-Yuan WU

IPC分类号： F28D15/02 ,  F28D15/04

CPC分类号： F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/046

摘要： A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.

公开(公告)号：US20180202723A1

公开(公告)日：2018-07-19

申请号：US15699726

申请日：2017-09-08

申请人： Delta Electronics, Inc.

发明人： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ting-Yuan WU

IPC分类号： F28D15/04

CPC分类号： F28D15/046 ,  F28D15/0233 ,  F28D2021/0028 ,  H01L23/427

摘要： A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

公开(公告)号：US20240295366A1

公开(公告)日：2024-09-05

申请号：US18662214

申请日：2024-05-13

申请人： Delta Electronics, Inc.

发明人： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ting-Yuan WU

IPC分类号： F28D15/04 ,  F28D15/02 ,  F28D21/00 ,  H01L23/427

CPC分类号： F28D15/046 ,  H01L23/427 ,  F28D15/0233 ,  F28D2021/0028

摘要： A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

公开(公告)号：US20220057143A1

公开(公告)日：2022-02-24

申请号：US17520958

申请日：2021-11-08

申请人： Delta Electronics, Inc.

发明人： Shih-Lin HUANG ,  Ting-Yuan WU

IPC分类号： F28D15/02 ,  F28D15/04

摘要： A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.