公开(公告)号：US20220003506A1

公开(公告)日：2022-01-06

申请号：US17169261

申请日：2021-02-05

Applicant: Delta Electronics, Inc.

Inventor： Chao-Wen Lu ,  Ting-Yuan Wu

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427

Abstract: The present disclosure provides a vapor chamber. The vapor chamber comprises a first casing, a second casing and a working fluid. The first casing has a first recess and a plurality of pillars. A fluid channel is formed among the plurality of pillars. The second casing has a second recess and a microstructure. The microstructure has a plurality of liquid storing concaves. The first casing is assembled with the second casing, the first recess and the second recess are sealed to form an accommodating space, and the plurality of pillars are corresponding in position to the microstructure. The working fluid is accommodated in the accommodating space and absorbed among the plurality of pillars and the microstructure by the capillary force, and flows in the fluid channel and the plurality of liquid storing concaves.

公开(公告)号：US11561050B2

公开(公告)日：2023-01-24

申请号：US16673212

申请日：2019-11-04

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shih-Lin Huang ,  Ting-Yuan Wu ,  Chiu-Kung Chen ,  Chun-Lung Chiu

IPC: F28D15/04 ,  F28F3/00 ,  F28F13/06 ,  F28D21/00

Abstract: A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. Both of a side of the first plate facing the second plate and a side of the second plate facing the first plate are formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.

公开(公告)号：US11965698B2

公开(公告)日：2024-04-23

申请号：US17520958

申请日：2021-11-08

Applicant: Delta Electronics, Inc.

Inventor： Shih-Lin Huang ,  Ting-Yuan Wu

IPC: F28D15/02 ,  F28D15/04

CPC classification number: F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/046

Abstract: A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.

公开(公告)号：US11543188B2

公开(公告)日：2023-01-03

申请号：US16742203

申请日：2020-01-14

Applicant: DELTA ELECTRONICS, INC.

Inventor： Li-Kuang Tan ,  Shih-Kang Lin ,  Kuo-Ying Lee ,  Ting-Yuan Wu ,  Chao-Wen Lu

IPC: F28D15/02 ,  F28D15/04 ,  H05K7/20 ,  F28D21/00

Abstract: A temperature plate device includes a plate body and a bent structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent structure is connected to and traverses the first step section between the first step section and the second step section.