公开(公告)号：US20190037706A1

公开(公告)日：2019-01-31

申请号：US16145142

申请日：2018-09-27

Applicant: Delta Electronics (Shanghai) Co.,Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K3/30 ,  H05K3/28 ,  H05K5/06 ,  H05K7/14

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

公开(公告)号：US20160374223A1

公开(公告)日：2016-12-22

申请号：US15067146

申请日：2016-03-10

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/30 ,  H05K3/284 ,  H05K5/064 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10636 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

Abstract translation: 封装模块包括电路板，布置在电路板上的电子部件，邻近电子部件的至少一侧设置的框架和密封剂。 在框架和电子部件之间形成间隙。 密封剂包括覆盖电路板的至少一部分的第一部分和填充到间隙的至少一部分中的第二部分。 第一部分具有相对于电路板的第一高度，并且第二部分具有相对于电路板的第二高度，其中第二高度大于第一高度。