公开(公告)号：US20160374223A1

公开(公告)日：2016-12-22

申请号：US15067146

申请日：2016-03-10

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/30 ,  H05K3/284 ,  H05K5/064 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10636 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

Abstract translation: 封装模块包括电路板，布置在电路板上的电子部件，邻近电子部件的至少一侧设置的框架和密封剂。 在框架和电子部件之间形成间隙。 密封剂包括覆盖电路板的至少一部分的第一部分和填充到间隙的至少一部分中的第二部分。 第一部分具有相对于电路板的第一高度，并且第二部分具有相对于电路板的第二高度，其中第二高度大于第一高度。

公开(公告)号：US20160365306A1

公开(公告)日：2016-12-15

申请号：US15068658

申请日：2016-03-14

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Kai LU ,  Zhen-Qing ZHAO ,  Tao WANG

IPC: H01L23/498 ,  H01L21/48 ,  H01L25/10 ,  H01L23/00 ,  H01L23/053 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A method of fabricating a package module includes placing a pin frame having plural pins on a circuit substrate; bonding the pins to corresponding bonding areas on a circuit substrate, thereby connecting the pins to the bonding areas; cutting off a connecting portion of the pin frame; and bending the pins to be vertical to the circuit substrate. By placing the pins on the corresponding bonding areas on the circuit substrate through the pin frame, and then cutting off the connecting portion of the pin frame and bending the pins, the efficiency of assembling the package module can be greatly promoted.

Abstract translation: 制造封装模块的方法包括将具有多个引脚的引脚框架放置在电路基板上; 将引脚连接到电路基板上的对应的接合区域，从而将引脚连接到接合区域; 切断销框架的连接部分; 并且使引脚弯曲成垂直于电路基板。 通过将销钉通过销框架放置在电路基板上的对应接合区域上，然后切断销框架的连接部分并弯曲销钉，可以大大提高组装封装模块的效率。

公开(公告)号：US20190037706A1

公开(公告)日：2019-01-31

申请号：US16145142

申请日：2018-09-27

Applicant: Delta Electronics (Shanghai) Co.,Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K3/30 ,  H05K3/28 ,  H05K5/06 ,  H05K7/14

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

公开(公告)号：US20150085454A1

公开(公告)日：2015-03-26

申请号：US14330045

申请日：2014-07-14

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Shou-Yu HONG ,  Gan-Yu ZHOU ,  Jian-Hong ZENG ,  Zhen-Qing ZHAO

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L23/3735 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0265 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≦d1≦50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≧100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.

Abstract translation: 公开了电源模块。 功率模块包括第一衬底，第一金属层，至少一个导电结构和至少一个功率器件。 第一金属层设置在第一基板上。 第一金属层具有第一厚度d1。 第一厚度d1满足：5μm＆nlE; d1＆nlE;50μm。 导电结构设置在与第一基板上的第一金属层不同的位置处。 导电结构具有第二厚度d2。 第二厚度d2满足：d2≥100μm。 功率器件设置在第一衬底，第一金属层或导电结构上。 功率器件的驱动电极与第一金属层电连接。 功率器件的功率电极电耦合到导电结构。

公开(公告)号：US20170358516A1

公开(公告)日：2017-12-14

申请号：US15671132

申请日：2017-08-07

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Shou-Yu HONG ,  Gan-Yu ZHOU ,  Jian-Hong ZENG ,  Zhen-Qing ZHAO

IPC: H01L23/373 ,  H01L23/433 ,  H01L23/498 ,  H01L25/07 ,  H01L23/495 ,  H01L23/36 ,  H05K1/02

CPC classification number: H01L23/3735 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0265 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≦d1≦50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≧100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.