公开(公告)号：US20140117495A1

公开(公告)日：2014-05-01

申请号：US13760079

申请日：2013-02-06

Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG

IPC: H01L23/66 ,  H01L25/00

CPC classification number: H01L25/50 ,  H01L23/49562 ,  H01L23/49589 ,  H01L23/642 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M1/44 ,  H02M3/155 ,  H05K1/0228 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation loops between the capacitor unit and the sub micro-switch elements are close to or the same with each other.

Abstract translation: 开关电路封装模块包括半导体开关单元和电容器单元。 半导体开关单元包括副微开关元件。 电容器单元布置在半导体开关单元的周围或层叠在半导体开关单元的表面上，使得电容器单元和子微开关元件之间的换向环的阻抗彼此接近或相同 。

公开(公告)号：US20190037706A1

公开(公告)日：2019-01-31

申请号：US16145142

申请日：2018-09-27

Applicant: Delta Electronics (Shanghai) Co.,Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K3/30 ,  H05K3/28 ,  H05K5/06 ,  H05K7/14

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

公开(公告)号：US20170358516A1

公开(公告)日：2017-12-14

申请号：US15671132

申请日：2017-08-07

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Shou-Yu HONG ,  Gan-Yu ZHOU ,  Jian-Hong ZENG ,  Zhen-Qing ZHAO

IPC: H01L23/373 ,  H01L23/433 ,  H01L23/498 ,  H01L25/07 ,  H01L23/495 ,  H01L23/36 ,  H05K1/02

CPC classification number: H01L23/3735 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0265 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≦d1≦50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≧100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.

公开(公告)号：US20160300659A1

公开(公告)日：2016-10-13

申请号：US15080548

申请日：2016-03-24

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Yu ZHANG ,  Shou-Yu HONG ,  Hao-Yi YE ,  Jian-Hong ZENG

IPC: H01F27/28 ,  H01F27/24 ,  H05K1/18

Abstract: A power module includes a magnetic component and a switch component. The magnetic component includes a magnetic core, and a winding disposed in the magnetic core. An end of the winding forms a pin of the power module for electrically connecting to an external circuit. The switch component is electrically connected to the magnetic component. An I/O pin of the power module may be formed from an end of the winding, such that a bonding/contact resistance of connecting the power module to the external circuit can be reduced.

Abstract translation: 功率模块包括磁性部件和开关部件。 磁性部件包括磁芯和设置在磁芯中的绕组。 绕组的一端形成用于电连接到外部电路的功率模块的引脚。 开关部件与磁性部件电连接。 功率模块的I / O引脚可以由绕组的端部形成，从而可以减少将功率模块连接到外部电路的接合/接触电阻。

公开(公告)号：US20170330846A1

公开(公告)日：2017-11-16

申请号：US15667640

申请日：2017-08-03

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG

IPC: H01L23/66 ,  H01L23/528 ,  G11B5/48 ,  H01L23/522 ,  H01L29/92 ,  H01L23/64

CPC classification number: H01L23/66 ,  G11B5/4873 ,  H01L21/568 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/5222 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L27/088 ,  H01L29/92 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The second semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The capacitor unit includes a plurality of capacitors. The semiconductor switch unit includes a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain of one sub micro-switch element in the second semiconductor switch element and is disposed adjacent to at least one drain electrode from the first semiconductor switch element or one source electrode from the second semiconductor switch element.

公开(公告)号：US20150180351A1

公开(公告)日：2015-06-25

申请号：US14581096

申请日：2014-12-23

Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG ,  Yi-Cong XIE

IPC: H02M3/335 ,  H02M1/44 ,  H02M1/42

CPC classification number: H02M1/44 ,  H02M3/00

Abstract: Disclosed herein is a power electronic circuit having a reference ground and a differential mode loop unit. The differential mode loop unit has a capacitance component, a switch and an electronic component, wherein the capacitance component has a first end, the switch has a first end connecting in series with the capacitance component, the electronic component has a first end, the electronic component connects in series with the capacitance component and the switch, the capacitance component and switch are packaged in a power module, the power module has a trace and at least one output pin connected to reference ground, wherein the first end of the switch or the first end of the electronic component is only connected to the first end of the capacitance component through the trace, and the first end of the capacitance component is connected to reference ground through the output pin.

Abstract translation: 这里公开了具有参考地和差模回路单元的电力电子电路。 差分模式环路单元具有电容部件，开关和电子部件，其中电容部件具有第一端，开关具有与电容部件串联连接的第一端，电子部件具有第一端，电子部件 组件与电容部件和开关串联连接，电容部件和开关被封装在电源模块中，电源模块具有一个跟踪和至少一个连接到参考接地的输出引脚，其中开关的第一端或 电子部件的第一端仅通过迹线连接到电容部件的第一端，并且电容部件的第一端通过输出引脚连接到参考接地。

公开(公告)号：US20150085454A1

公开(公告)日：2015-03-26

申请号：US14330045

申请日：2014-07-14

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Shou-Yu HONG ,  Gan-Yu ZHOU ,  Jian-Hong ZENG ,  Zhen-Qing ZHAO

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L23/3735 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0265 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≦d1≦50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≧100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.

Abstract translation: 公开了电源模块。 功率模块包括第一衬底，第一金属层，至少一个导电结构和至少一个功率器件。 第一金属层设置在第一基板上。 第一金属层具有第一厚度d1。 第一厚度d1满足：5μm＆nlE; d1＆nlE;50μm。 导电结构设置在与第一基板上的第一金属层不同的位置处。 导电结构具有第二厚度d2。 第二厚度d2满足：d2≥100μm。 功率器件设置在第一衬底，第一金属层或导电结构上。 功率器件的驱动电极与第一金属层电连接。 功率器件的功率电极电耦合到导电结构。

公开(公告)号：US20160374223A1

公开(公告)日：2016-12-22

申请号：US15067146

申请日：2016-03-10

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/30 ,  H05K3/284 ,  H05K5/064 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10636 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

Abstract translation: 封装模块包括电路板，布置在电路板上的电子部件，邻近电子部件的至少一侧设置的框架和密封剂。 在框架和电子部件之间形成间隙。 密封剂包括覆盖电路板的至少一部分的第一部分和填充到间隙的至少一部分中的第二部分。 第一部分具有相对于电路板的第一高度，并且第二部分具有相对于电路板的第二高度，其中第二高度大于第一高度。

公开(公告)号：US20150318242A1

公开(公告)日：2015-11-05

申请号：US14798484

申请日：2015-07-14

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG

IPC: H01L23/522 ,  H01L27/088

CPC classification number: H01L23/66 ,  G11B5/4873 ,  H01L21/568 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/5222 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L27/088 ,  H01L29/92 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The second semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The capacitor unit includes a plurality of capacitors. The semiconductor switch unit includes a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain of one sub micro-switch element in the second semiconductor switch element and is disposed adjacent to at least one drain electrode from the first semiconductor switch element or one source electrode from the second semiconductor switch element.

Abstract translation: 开关电路封装模块包括半导体开关单元和电容器单元。 半导体开关单元包括第一半导体开关元件和第二半导体开关元件。 第一半导体开关元件包括副微开关元件，每个子微开关元件配置有漏电极和源电极。 第二半导体开关元件包括副微开关元件，每个子微开关元件配置有漏电极和源电极。 电容器单元包括多个电容器。 半导体开关单元包括多个公共电极，每个公共电极将第一半导体开关元件中的一个子微开关元件的源电极与第二半导体开关元件中的一个子微开关元件的漏极连接， 邻近于来自第一半导体开关元件的至少一个漏电极或来自第二半导体开关元件的一个源电极。

公开(公告)号：US20150318234A1

公开(公告)日：2015-11-05

申请号：US14798419

申请日：2015-07-13

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG

IPC: H01L23/495 ,  H01L23/64

CPC classification number: H01L25/50 ,  H01L23/49562 ,  H01L23/49589 ,  H01L23/642 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M1/44 ,  H02M3/155 ,  H05K1/0228 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A switch circuit package module includes at least a semiconductor switch unit and at least a first capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element and the second semiconductor switch element include a plurality of sub micro-switch elements. The capacitor unit includes a plurality of capacitors configured to cooperate with the sub micro-switch elements. The capacitors are arranged in a symmetrical distribution surrounded the semiconductor switch unit, such that impedances of any two symmetrical commutation loops each of which mainly consists of one capacitor and two sub micro-switch elements from the first semiconductor switch element and second semiconductor switch element respectively are close to or the same with each other.

Abstract translation: 开关电路封装模块至少包括半导体开关单元和至少第一电容器单元。 半导体开关单元包括第一半导体开关元件和第二半导体开关元件。 第一半导体开关元件和第二半导体开关元件包括多个子微开关元件。 电容器单元包括配置成与子微开关元件配合的多个电容器。 电容器被布置成围绕半导体开关单元的对称分布，使得任何两个对称换向回路的阻抗分别主要由来自第一半导体开关元件和第二半导体开关元件的一个电容器和两个子微开关元件组成 彼此接近或相同。