公开(公告)号：US20070084732A1

公开(公告)日：2007-04-19

申请号：US11541806

申请日：2006-10-02

申请人： Deyan Wang ,  Robert Mikkola ,  George Barclay

发明人： Deyan Wang ,  Robert Mikkola ,  George Barclay

IPC分类号： C25D3/38

CPC分类号： C25D3/38 ,  C25D3/02 ,  C25D3/40 ,  C25D7/12 ,  C25D7/123 ,  H05K3/423

摘要： Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.

摘要翻译： 提供金属电镀浴的流平剂。 含有这种流平剂的镀浴提供具有基本水平表面的金属沉积物。 可以选择这种流平剂以选择性地将期望水平的杂质掺入到金属沉积物中。

公开(公告)号：US20060016693A1

公开(公告)日：2006-01-26

申请号：US11182311

申请日：2005-07-16

申请人： Deyan Wang ,  Robert Mikkola ,  Chunyi Wu ,  George Barclay

发明人： Deyan Wang ,  Robert Mikkola ,  Chunyi Wu ,  George Barclay

IPC分类号： C25D3/38

CPC分类号： C08G59/184 ,  C25D3/38 ,  H01L21/2885 ,  H05K3/423

摘要： Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.

公开(公告)号：US20050020068A1

公开(公告)日：2005-01-27

申请号：US10852706

申请日：2004-05-24

申请人： Deyan Wang ,  Robert Mikkola

发明人： Deyan Wang ,  Robert Mikkola

IPC分类号： C25D3/38 ,  C25D5/54 ,  C25D7/12 ,  H01L21/288 ,  H01L21/44 ,  H01L21/768

CPC分类号： H01L21/76843 ,  C25D3/38 ,  C25D5/54 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76868 ,  H01L21/76873

摘要： Compositions suitable for electroplating copper including one or more sources of copper, one or more alkanolamines or polymeric amines; and water are provided. These compositions are useful in the deposition and repair of seed layers used in the manufacture of electronic devices. Methods using these compositions are also provided.

摘要翻译： 适用于电镀铜的组合物，包括一种或多种铜源，一种或多种链烷醇胺或聚合胺; 并提供水。 这些组合物可用于电子设备制造中使用的种子层的沉积和修复。 还提供了使用这些组合物的方法。