CUSTOMIZED VIDEO MOSAIC
    1.
    发明申请
    CUSTOMIZED VIDEO MOSAIC 有权
    自定义视频MOSAIC

    公开(公告)号:US20150181132A1

    公开(公告)日:2015-06-25

    申请号:US14139299

    申请日:2013-12-23

    Abstract: Various arrangements for outputting a customized video mosaic are presented. Based on received user input, it may be determined that a customized video mosaic is to be output for presentation. A plurality of television channels to be presented as part of the customized video mosaic may be determined. One or more tuners may be tuned based on the determined plurality of television channels to be presented. The plurality of television channels may be output for presentation to a presentation device. Each of these television channels may be presented by the presentation device as live video simultaneously as part of the customized video mosaic.

    Abstract translation: 呈现用于输出定制视频镶嵌的各种布置。 基于接收的用户输入,可以确定要输出定制的视频马赛克用于呈现。 可以确定要呈现为定制视频马赛克的一部分的多个电视频道。 可以基于要呈现的确定的多个电视频道来调谐一个或多个调谐器。 可以输出多个电视频道以呈现给演示装置。 这些电视频道中的每一个可以由呈现装置作为实时视频呈现,作为定制的视频镶嵌的一部分。

    SELF-ADJUSTABLE HEAT SPREADER SYSTEM FOR SET-TOP BOX ASSEMBLIES

    公开(公告)号:US20170196121A1

    公开(公告)日:2017-07-06

    申请号:US14986065

    申请日:2015-12-31

    CPC classification number: H05K7/20509 H05K1/0201 H05K7/20454 H05K7/2049

    Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

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