Abstract:
Technologies described herein are generally related to graphene production. In some examples, a system is described that may include a first container, a second container, and/or a chamber. The first container may include a first solution with a reducing agent, while the second container may include a second solution with graphene oxide. The chamber may be in operative relationship with the first and the second containers, and configured effective to receive the first and second solutions and provide reaction conditions that facilitate contact of the first and second solutions at an interfacial region sufficient to produce graphene at the interfacial region.
Abstract:
Technologies are generally described for a photoresist and methods and systems effective to form a pattern in a photoresist on a substrate. In some examples, the photoresist includes a resin, a photoinitiator and a photoinhibitor. The photoinitiator may be effective to generate a first reactant upon the absorption of at least one photon of a particular wavelength of light. The first reactant may be effective to render the resin soluble or insoluble in a photoresist developer. The photoinhibitor may be effective to generate a second reactant upon the absorption of at least one photon of the particular wavelength of light. The second reactant may be effective to inhibit the first reactant.
Abstract:
Technologies are generally described for method and systems effective to at least partially alter a defect in a layer including graphene. In some examples, the methods may include receiving the layer on a substrate where the layer includes at least some graphene and at least some defect areas in the graphene. The defect areas may reveal exposed areas of the substrate. The methods may also include reacting the substrate under sufficient reaction conditions to produce at least one cationic area in at least one of the exposed areas. The methods may further include adhering graphene oxide to the at least one cationic area to produce a graphene oxide layer. The methods may further include reducing the graphene oxide layer to produce at least one altered defect area in the layer.
Abstract:
Technologies are generally described for methods, systems, and structures that include patterns formed by optical lithography. In some example methods, a photoresist layer is applied to a substrate, and a grapheme layer can be applied to the photoresist layer. Light can be applied through a mask to the graphene layer, where the mask includes a pattern. The light can form the pattern on the graphene layer such that the pattern forms on the photoresist layer.
Abstract:
Technologies described herein are generally related to systems and processes for repairing a graphene membrane on a support. A chamber may receive a layer of graphene on a support. The layer of graphene may include a hole. A first container including an initiator may be effective to apply an initiator through the hole to the support to functionalize the support and produce an initiator layer on the support. A second container including an activator may be effective to apply an activator through the hole to the initiator layer to activate the initiator layer. The application of the activator may further be effective to grow a polymer from the initiator layer. The growth of the polymer may be effective to produce a polymer plug in the hole and effective to repair at least a portion of the layer of graphene.
Abstract:
Technologies are generally described for a method and system configured effective to alter a defect area in a layer on a substrate including graphene. An example method may include receiving and heating the layer to produce a heated layer and exposing the heated layer to a first gas to produce a first exposed layer, where the first gas may include an amine. The method may further include exposing the first exposed layer to a first inert gas to produce a second exposed layer and exposing the second exposed layer to a second gas to produce a third exposed layer where the second gas may include an alane or a borane. Exposure of the second exposed layer to the second gas may at least partially alter the defect area.