公开(公告)号：US10351809B2

公开(公告)日：2019-07-16

申请号：US15540293

申请日：2016-01-05

Applicant: ENTEGRIS, INC.

Inventor： Elizabeth Thomas ,  Donald Frye ,  Jun Liu ,  Michael White ,  Danela White ,  Chao-Yu Wang

IPC: C11D3/30 ,  C11D11/00 ,  H01L21/02 ,  B08B3/08 ,  C11D3/20 ,  C11D3/26 ,  C11D3/34 ,  C11D7/32 ,  C11D1/62 ,  H01L21/321 ,  H01L21/768

Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of alkali hydroxides, alkaline earth metal hydroxides, and tetramethylammonium hydroxide. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.