公开(公告)号：US20170094801A1

公开(公告)日：2017-03-30

申请号：US15170943

申请日：2016-06-02

Applicant: ETHERTRONICS, INC.

Inventor： Seung Hyuk CHOI ,  Hyun Jun HONG ,  Tae Wook KIM ,  Cheong Ho RYU ,  Young Sang KIM ,  Sung Jun KIM

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K3/0026 ,  H05K3/0014 ,  H05K3/185 ,  H05K3/188 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0582 ,  H05K2203/0588 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.