公开(公告)号：US12122078B2

公开(公告)日：2024-10-22

申请号：US17766550

申请日：2020-07-29

申请人： NISSHA CO., LTD.

发明人： Seiichi Yamazaki ,  Toshihiro Higashikawa ,  Hitoshi Hirai

IPC分类号： H05K1/02 ,  B29C45/14 ,  H05K3/00 ,  B29L31/34

CPC分类号： B29C45/14639 ,  B29C45/14008 ,  B29C45/1418 ,  B29C45/14819 ,  H05K1/028 ,  H05K3/0014 ,  B29C2045/14245 ,  B29L2031/3425 ,  H05K2201/09118 ,  H05K2203/1305

摘要： Object
There is provided a molded article or an electrical product in which layout of a member up to an external connection terminal for electrical connection of a circuit film integrally molded with the molded body is easy.
Solution means
A molded body 30 includes one main surface 31 with which a circuit film 20 is integrally molded, and another main surface 32 facing the one main surface 31. A flexible printed wiring board 40 includes an internal connection terminal 41 electrically connected to an electrical circuit of the circuit film 20, an external connection terminal 42 exposed outside from the other main surface 32 of the molded body 30, and a flexible wiring line 43 connected to the inner connection terminal 41 and the external connection terminal 42, passing through an inside of the molded body 30, and extending so as to reach the other main surface 32.

公开(公告)号：US20240292534A1

公开(公告)日：2024-08-29

申请号：US18657331

申请日：2024-05-07

申请人： LG INNOTEK CO., LTD.

发明人： Il Sik Nam ,  Yong Suk Kim ,  Dong Keun Lee ,  Tae Ki Kim ,  Hye Jin Jo

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/113 ,  H05K1/0256 ,  H05K2201/09118

摘要： A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.

公开(公告)号：US11942389B2

公开(公告)日：2024-03-26

申请号：US17330787

申请日：2021-05-26

申请人： Qorvo US, Inc.

发明人： Julio C. Costa ,  George Maxim

IPC分类号： H01L23/28 ,  H01L23/31 ,  H01L23/36 ,  H01L23/482 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/4828 ,  H01L23/49568 ,  H01L23/498 ,  H05K1/021 ,  H05K2201/09118

摘要： The present disclosure relates to a thermally enhanced package, which includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor. The thinned die includes a device layer over the carrier and a dielectric layer over the device layer. The mold compound resides over the carrier, surrounds the thinned die, and extends beyond a top surface of the thinned die to define an opening within the mold compound and over the thinned die. The top surface of the thinned die is at a bottom of the opening. At least a portion of the heat extractor is inserted into the opening and in thermal contact with the thinned die. Herein the heat extractor is formed of a metal or an alloy.

公开(公告)号：US20240032190A1

公开(公告)日：2024-01-25

申请号：US18481116

申请日：2023-10-04

申请人： CANON KABUSHIKI KAISHA

发明人： KOICHI ODAGAKI ,  YOSHIHIKO FUJISE

IPC分类号： H05K1/02 ,  H04N23/68 ,  H04N23/50 ,  H01R12/70 ,  H05K1/18 ,  H01R12/71

CPC分类号： H05K1/0284 ,  H05K1/0296 ,  H04N23/6812 ,  H04N23/50 ,  H01R12/7082 ,  H05K2201/09754 ,  H05K2201/10151 ,  H05K2201/09236 ,  H05K2201/0999 ,  H05K2201/09163 ,  H05K2201/09118 ,  H05K1/181 ,  H01R12/714 ,  H05K2201/09045

摘要： A base member that is a molded part on which pattern wiring is directly formed, includes a projection projecting from a base surface of the base member. The pattern wiring is laid over a top of the projection, and protrusions are molded on both sides of an area at the top of the projection where the pattern wiring passes.

公开(公告)号：US11800249B2

公开(公告)日：2023-10-24

申请号：US17646751

申请日：2022-01-03

申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Yuta Momiuchi ,  Yuji Takaoka

IPC分类号： H04N25/70 ,  H01L27/146 ,  H04N23/00 ,  H04N23/54 ,  H04N23/57 ,  H04N25/44 ,  G03B17/02 ,  H05K1/18 ,  H05K3/10

CPC分类号： H04N25/70 ,  G03B17/02 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/14636 ,  H04N23/00 ,  H04N23/54 ,  H04N23/57 ,  H04N25/44 ,  H05K1/185 ,  H05K3/103 ,  H05K2201/095 ,  H05K2201/09118

摘要： A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal and a pad 23 provided in the rewiring region 22 are formed via insulating layers 41a, 42a, and 43a on a side of the pixel formation surface of the imaging element 20 and the mold part 30. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device 10 is also on the side of the pixel formation surface, and reduction in size and height can be achieved.

公开(公告)号：US11770896B2

公开(公告)日：2023-09-26

申请号：US17760259

申请日：2021-02-04

申请人： HARTING AG

发明人： Thomas Hess

IPC分类号： H05K1/14 ,  H05K3/34 ,  H05K1/11

CPC分类号： H05K1/119 ,  H05K1/141 ,  H05K3/341 ,  H05K2201/09118 ,  H05K2201/10568

摘要： Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

公开(公告)号：US11744022B2

公开(公告)日：2023-08-29

申请号：US17536429

申请日：2021-11-29

申请人： Kyocera AVX Components (San Diego), Inc.

发明人： Seung Hyuk Choi ,  Hyun Jun Hong ,  Tae Wook Kim ,  Cheong Ho Ryu ,  Young Sang Kim ,  Sung Jun Kim

IPC分类号： H05K3/46 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  H05K3/42

CPC分类号： H05K3/0026 ,  H05K3/0014 ,  H05K3/185 ,  H05K3/188 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0582 ,  H05K2203/0588 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.

公开(公告)号：US20230199961A1

公开(公告)日：2023-06-22

申请号：US17702814

申请日：2022-03-24

申请人： Industrial Technology Research Institute

发明人： Yu-Lin Hsu ,  Kuan-Chu Wu ,  Ting-Yu Ke ,  Min-Hsiung Liang ,  Yu-Ming Peng

IPC分类号： H05K1/11 ,  H01L23/538 ,  H01L23/13 ,  H05K3/00 ,  H01L21/48

CPC分类号： H05K1/119 ,  H01L23/5386 ,  H01L23/13 ,  H05K3/0014 ,  H01L21/4846 ,  H05K2201/09018 ,  H05K2201/09118 ,  H01L23/3121

摘要： An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.

公开(公告)号：US11676878B2

公开(公告)日：2023-06-13

申请号：US17330787

申请日：2021-05-26

申请人： Qorvo US, Inc.

发明人： Julio C. Costa ,  George Maxim

IPC分类号： H01L23/28 ,  H01L23/36 ,  H01L23/31 ,  H01L23/482 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/4828 ,  H01L23/498 ,  H01L23/49568 ,  H05K1/021 ,  H05K2201/09118

摘要： The present disclosure relates to a thermally enhanced package, which includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor. The thinned die includes a device layer over the carrier and a dielectric layer over the device layer. The mold compound resides over the carrier, surrounds the thinned die, and extends beyond a top surface of the thinned die to define an opening within the mold compound and over the thinned die. The top surface of the thinned die is at a bottom of the opening. At least a portion of the heat extractor is inserted into the opening and in thermal contact with the thinned die. Herein the heat extractor is formed of a metal or an alloy.

公开(公告)号：US20190124763A1

公开(公告)日：2019-04-25

申请号：US16229948

申请日：2018-12-21

申请人： MEIKO ELECTRONICS CO., LTD.

发明人： Shigeru MICHIWAKI

IPC分类号： H05K1/02 ,  H05K3/14 ,  H05K3/00 ,  H05K3/42 ,  H05K1/09 ,  H05K1/03

CPC分类号： H05K1/0284 ,  H05K1/0326 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/0023 ,  H05K3/14 ,  H05K3/181 ,  H05K3/389 ,  H05K3/426 ,  H05K2201/0129 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2203/072 ,  H05K2203/124 ,  H05K2203/1461

摘要： A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film (1) having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film (3) on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film (21) on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.