Abstract:
A crystal oscillation circuit, a gain stage of the crystal oscillation circuit and a method for designing the same are provided. The gain stage includes multiple amplifiers and multiple current-limiting resistors. Input terminals of the amplifiers are coupled together to a first bonding pad, wherein transconductances of the amplifiers are different from each other. The first bonding pad is used for electrically coupling to a first terminal of an oscillation crystal module. First terminals of the current-limiting resistors are respectively coupled to output terminals of the amplifiers in a one-on-one manner, and second terminals of the current-limiting resistors are coupled together to a second bonding pad, wherein the second bonding pad is used for electrically coupling to a second terminal of the oscillation crystal module.
Abstract:
A core power detection circuit and an associated input/output (I/O) control system are provided, where the core power detection circuit is utilized for performing power detection in the I/O control system to generate a core power detection signal to control the I/O control system, and the I/O control system operates according to a plurality of supply voltages with respect to a first reference voltage. The core power detection circuit includes: a reference power bias circuit arranged for generating a second reference voltage according to a first supply voltage of the plurality of supply voltages; and a comparison circuit, coupled to the reference power bias circuit, arranged for performing a comparison operation according to the second reference voltage and a second supply voltage of the plurality of supply voltages, to generate a third reference voltage.
Abstract:
A electrostatic discharge (ESD) protection apparatus for an integrated circuit (IC) is provided. A first electrostatic current rail and a second electrostatic current rail of the ESD protection apparatus do not directly connected to any bonding pad of the IC. The ESD protection apparatus further includes a clamp circuit and four ESD protection circuits. The clamp circuit is coupled between the first electrostatic current rail and the second electrostatic current rail. A first ESD protection circuit is coupled between the first electrostatic current rail and a signal pad of the IC. A second ESD protection circuit is coupled between the signal pad and the second electrostatic current rail. A third ESD protection circuit is coupled between a first power rail and the second electrostatic current rail. A fourth ESD protection circuit is coupled between the second electrostatic current rail and a second power rail.
Abstract:
A power-on-reset circuit including a first diode-connected transistor, a second diode-connected transistor, a resistor and a current comparator circuit is provided. A cathode of the first diode-connected transistor is coupled to a reference voltage. A first end of the resistor is coupled to a power voltage. A second end of the resistor is coupled to an anode of the first diode-connected transistor. A cathode of the second diode-connected transistor is coupled to the reference voltage. An anode of the second diode-connected transistor is coupled to the first end of the resistor. The current comparator circuit is coupled to the first diode-connected transistor and the second diode-connected transistor. The current comparator circuit compares a current of the first diode-connected transistor with a current of the second diode-connected transistor to obtain a comparing result, wherein the comparing result determines a reset signal.