公开(公告)号：US09321245B2

公开(公告)日：2016-04-26

申请号：US13925050

申请日：2013-06-24

Applicant: GLOBALFOUNDRIES INC.

Inventor： Michael A. Gaynes ,  Eric P. Lewandowski ,  Jae-Woong Nah ,  Robert J. Polastre

IPC: B05D5/12 ,  B32B9/00 ,  H05K5/06 ,  B05D3/04 ,  B32B37/10 ,  H01L23/00 ,  H05K3/24 ,  H05K3/34

CPC classification number: B32B9/00 ,  B05D3/0406 ,  B32B37/1018 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K3/24 ,  H05K3/341 ,  H05K5/065 ,  H01L2924/00

Abstract: A method for providing a matrix material between a bonded pair of substrates with a homogeneous distribution of anisotropic filler particles is provided. Functionalized anisotropic filler particles are mixed uniformly with a matrix material to form a homogenous mixture. A bonded assembly of a first substrate and a second substrate with an array of electrical interconnect structures is placed within a vacuum environment. The homogenous mixture of the matrix material and the anisotropic filler particles is dispensed around the array of electrical interconnect structures. A gas is abruptly introduced into the vacuum environment to induce an implosion of the homogenous mixture. The implosion causes the homogenous mixture to fill the cavity between the first and second substrates without causing agglomeration of the anisotropic filler particles. The mixture filling the space between the first and second substrates has a homogenous distribution of the anisotropic filler particles.

Abstract translation: 提供了一种在粘合的一对基板之间提供具有各向异性填料颗粒的均匀分布的基质材料的方法。 官能化的各向异性填料颗粒与基体材料均匀混合以形成均匀的混合物。 将第一基板和具有电互连结构阵列的第二基板的接合组件放置在真空环境内。 基体材料和各向异性填料颗粒的均匀混合物分布在电互连结构阵列周围。 气体突然引入真空环境以引起均匀混合物的内爆。 内爆使均匀混合物填充第一和第二基底之间的空腔，而不会引起各向异性填料颗粒的团聚。 填充第一和第二基板之间的空间的混合物具有各向异性填料颗粒的均匀分布。