公开(公告)号：US10790204B2

公开(公告)日：2020-09-29

申请号：US16185696

申请日：2018-11-09

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mankyu Yang ,  Vara Govindeswara Reddy Vakada ,  Edward Maciejewski ,  Brian Greene ,  Atsushi Ogino ,  Vikrant Chauhan ,  Prianka Sengupta

IPC: H01L23/528 ,  H01L21/768 ,  H01L21/66 ,  H01L29/772

Abstract: Structures for testing a field effect-transistor or Kelvin field-effect transistor, and methods of forming a structure for testing a field-effect transistor or Kelvin field-effect transistor. The structure includes a test pad, a device-under-testing having one or more source/drain regions, and a metallization level arranged over the device-under-testing. The metallization level includes one or more interconnect lines that are connected with the test pad. One or more contacts, which are arranged between the metallization level and the device-under-testing, directly connect the one or more interconnect lines with the one or more source/drain regions.

公开(公告)号：US10796973B2

公开(公告)日：2020-10-06

申请号：US16425387

申请日：2019-05-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mankyu Yang ,  Vara Govindeswara Reddy Vakada ,  Edward Maciejewski ,  Brian Greene ,  Atsushi Ogino ,  Vikrant Chauhan ,  Prianka Sengupta

IPC: H01L29/423 ,  H01L21/66 ,  G01R31/26 ,  H01L23/528 ,  H01L23/522

Abstract: Structures for testing a field effect-transistor or Kelvin field-effect transistor, and methods of forming a structure for testing a field-effect transistor or Kelvin field-effect transistor. The structure includes a device-under-testing that has one or more source/drain regions and a first metallization level arranged over the device-under-testing. The first metallization level includes one or more first interconnect lines. The structure further includes a contact level having one or more first contacts arranged between the first metallization level and the device-under-testing. The one or more first contacts directly connect the one or more first interconnect lines with the one or more source/drain regions. The structure further includes a second metallization level arranged over the first metallization level. The second metallization level has a first test pad and one or more second interconnect lines connecting the one or more first interconnect lines with the first test pad.

公开(公告)号：US20200152531A1

公开(公告)日：2020-05-14

申请号：US16425387

申请日：2019-05-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mankyu Yang ,  Vara Govindeswara Reddy Vakada ,  Edward Maciejewski ,  Brian Greene ,  Atsushi Ogino ,  Vikrant Chauhan ,  Prianka Sengupta

IPC: H01L21/66 ,  H01L23/522 ,  H01L23/528 ,  G01R31/26

Abstract: Structures for testing a field effect-transistor or Kelvin field-effect transistor, and methods of forming a structure for testing a field-effect transistor or Kelvin field-effect transistor. The structure includes a device-under-testing that has one or more source/drain regions and a first metallization level arranged over the device-under-testing. The first metallization level includes one or more first interconnect lines. The structure further includes a contact level having one or more first contacts arranged between the first metallization level and the device-under-testing. The one or more first contacts directly connect the one or more first interconnect lines with the one or more source/drain regions. The structure further includes a second metallization level arranged over the first metallization level. The second metallization level has a first test pad and one or more second interconnect lines connecting the one or more first interconnect lines with the first test pad.

公开(公告)号：US20200152530A1

公开(公告)日：2020-05-14

申请号：US16185696

申请日：2018-11-09

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mankyu Yang ,  Vara Govindeswara Reddy Vakada ,  Edward Maciejewski ,  Brian Greene ,  Atsushi Ogino ,  Vikrant Chauhan ,  Prianka Sengupta

IPC: H01L21/66 ,  H01L23/528 ,  H01L21/768

Abstract: Structures for testing a field effect-transistor or Kelvin field-effect transistor, and methods of forming a structure for testing a field-effect transistor or Kelvin field-effect transistor. The structure includes a test pad, a device-under-testing having one or more source/drain regions, and a metallization level arranged over the device-under-testing. The metallization level includes one or more interconnect lines that are connected with the test pad. One or more contacts, which are arranged between the metallization level and the device-under-testing, directly connect the one or more interconnect lines with the one or more source/drain regions.