公开(公告)号：US20200144365A1

公开(公告)日：2020-05-07

申请号：US16180486

申请日：2018-11-05

Applicant: GLOBALFOUNDRIES INC.

Inventor： George R. MULFINGER ,  Timothy J. MCARDLE ,  Judson R. HOLT ,  Steffen A. SICHLER ,  Ömür I. AYDIN ,  Wei HONG ,  Yi QI ,  Hui ZANG ,  Liu JIANG

IPC: H01L29/08 ,  H01L21/8238 ,  H01L29/06 ,  H01L21/28 ,  H01L29/423

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to faceted epitaxial source/drain regions and methods of manufacture. The structure includes: a gate structure over a substrate; an L-shaped sidewall spacer located on sidewalls of the gate structure and extending over the substrate adjacent to the gate structure; and faceted diffusion regions on the substrate, adjacent to the L-shaped sidewall spacer.

公开(公告)号：US20180233505A1

公开(公告)日：2018-08-16

申请号：US15719014

申请日：2017-09-28

Applicant: GLOBALFOUNDRIES Inc.

Inventor： George R. MULFINGER ,  Lakshmanan H. VANAMURTHY ,  Scott BEASOR ,  Timothy J. MCARDLE ,  Judson R. HOLT ,  Hao ZHANG

IPC: H01L27/092 ,  H01L29/08 ,  H01L21/8238 ,  H01L29/78 ,  H01L29/165 ,  H01L21/02 ,  H01L29/167 ,  H01L21/285 ,  H01L29/66 ,  H01L21/265 ,  H01L29/45

Abstract: A method for forming a self-aligned sacrificial epitaxial cap for trench silicide and the resulting device are provided. Embodiments include a Si fin formed in a PFET region; a pair of Si fins formed in a NFET region; epitaxial S/D regions formed on ends of the Si fins; a replacement metal gate formed over the Si fins in the PFET and NFET regions; metal silicide trenches formed over the epitaxial S/D regions in the PFET and NEFT regions; a metal layer formed over top surfaces of the S/D region in the PFET region and top and bottom surfaces of the S/D regions in the NFET region, wherein the epitaxial S/D regions in the PFET and NFET regions are diamond shaped in cross-sectional view.