公开(公告)号：US07542125B2

公开(公告)日：2009-06-02

申请号：US11281324

申请日：2005-11-16

申请人： Gi-Heon Kim ,  Dae-Ho Choo ,  Baek-Kyun Jeon ,  Hyung-Woo Nam

发明人： Gi-Heon Kim ,  Dae-Ho Choo ,  Baek-Kyun Jeon ,  Hyung-Woo Nam

IPC分类号： G02F1/13 ,  B23K26/14

CPC分类号： C03B33/093 ,  B23K26/0736 ,  B23K26/146 ,  B23K26/364 ,  B23K26/38 ,  B23K26/40 ,  B23K26/703 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0011 ,  C03B33/09 ,  C03B33/102 ,  C09K5/10 ,  G02F1/133351 ,  Y02P40/57 ,  Y10T225/10 ,  Y10T225/304 ,  Y10T225/307

摘要： Disclosed is a method of cutting a liquid crystal display (LCD) unit cell from an LCD assembly panel. The method includes applying a coolant onto heated cutting path formed on the LCD assembly panel. A rapidly heated portion of the substrate is rapidly cooled using water having a high specific heat or a mixed coolant in which a material for improving characteristics of surface tension, viscosity and thermal conductivity is dissolved in water. Therefore, the cutting quality of the substrate is improved, and a cutting speed is also enhanced.

摘要翻译： 公开了一种从LCD组装面板切割液晶显示（LCD）单元的方法。 该方法包括将冷却剂施加到形成在LCD组件面板上的加热切割路径上。 使用具有高比热的水或混合冷却剂快速冷却基板的快速加热部分，其中用于改善表面张力特性，粘度和导热性的材料溶解在水中。 因此，提高了基板的切割质量，并且还提高了切割速度。

公开(公告)号：US20060065647A1

公开(公告)日：2006-03-30

申请号：US11281324

申请日：2005-11-16

申请人： Gi-Heon Kim ,  Dae-Ho Choo ,  Baek-Kyun Jeon ,  Hyung-Woo Nam

发明人： Gi-Heon Kim ,  Dae-Ho Choo ,  Baek-Kyun Jeon ,  Hyung-Woo Nam

IPC分类号： B23K26/38

CPC分类号： C03B33/093 ,  B23K26/0736 ,  B23K26/146 ,  B23K26/364 ,  B23K26/38 ,  B23K26/40 ,  B23K26/703 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0011 ,  C03B33/09 ,  C03B33/102 ,  C09K5/10 ,  G02F1/133351 ,  Y02P40/57 ,  Y10T225/10 ,  Y10T225/304 ,  Y10T225/307

摘要： Disclosed is a method of cutting a liquid crystal display (LCD) unit cell from an LCD assembly panel. The method includes applying a coolant onto heated cutting path formed on the LCD assembly panel. A rapidly heated portion of the substrate is rapidly cooled using water having a high specific heat or a mixed coolant in which a material for improving characteristics of surface tension, viscosity and thermal conductivity is dissolved in water. Therefore, the cutting quality of the substrate is improved, and a cutting speed is also enhanced.

摘要翻译： 公开了一种从LCD组装面板切割液晶显示（LCD）单元的方法。 该方法包括将冷却剂施加到形成在LCD组件面板上的加热切割路径上。 使用具有高比热的水或混合冷却剂快速冷却基板的快速加热部分，其中用于改善表面张力特性，粘度和导热性的材料溶解在水中。 因此，提高了基板的切割质量，并且还提高了切割速度。

公开(公告)号：US06770842B2

公开(公告)日：2004-08-03

申请号：US10176041

申请日：2002-06-21

申请人： Hyung-Woo Nam ,  Dae-Ho Choo ,  Baek-Kyun Jeon

发明人： Hyung-Woo Nam ,  Dae-Ho Choo ,  Baek-Kyun Jeon

IPC分类号： B23K2600

CPC分类号： B23K26/0673 ,  B23K26/067 ,  B23K26/146 ,  C03B33/093 ,  C03B33/102 ,  G02F1/133351 ,  Y02P40/57

摘要： A method and apparatus for multiple-cutting a substrate into a plurality of pieces with a single irradiation of a laser beam are disclosed. At least two light reflectivity/transmittance control plates are placed on a path through which the light passes such that light reflectivity/transmittance is varied depending on an angle between the generated light and the plates. Plural surface portions of the substrate are heated simultaneously and are then cooled by a sprayed coolant so that the substrate is cut into a plurality of pieces simultaneously. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.

公开(公告)号：US06713720B2

公开(公告)日：2004-03-30

申请号：US10109977

申请日：2002-03-27

申请人： Baek-Kyun Jeon ,  Dae-Ho Choo ,  Hyung-Woo Nam ,  Yong-Joon Kwon

发明人： Baek-Kyun Jeon ,  Dae-Ho Choo ,  Hyung-Woo Nam ,  Yong-Joon Kwon

IPC分类号： B23K2638

CPC分类号： C03B33/093 ,  B23K26/40 ,  B23K26/60 ,  B23K2101/40 ,  B23K2103/50 ,  G02F1/133351 ,  Y02P40/57 ,  Y10T225/304

摘要： Disclosed is a method for cutting a non-metallic substrate. A designated cutting line formed on the non-metallic substrate is cut using a thermal stress generated by rapidly heating and cooling the designated cutting line. Further, a shape and an arrangement, etc., of an energy source is optimized, thereby maximizing a cutting speed of the non-metallic substrate and also precisely cutting the non-metallic substrate.

摘要翻译： 公开了一种切割非金属基板的方法。 使用通过快速加热和冷却指定切割线而产生的热应力来切割形成在非金属基板上的指定切割线。 此外，能量源的形状和布置等被优化，从而最大化非金属基底的切割速度并且还精确地切割非金属基底。

公开(公告)号：US06653210B2

公开(公告)日：2003-11-25

申请号：US10150971

申请日：2002-05-21

申请人： Dae-Ho Choo ,  Baek-Kyun Jeon ,  Hyung-Woo Nam

发明人： Dae-Ho Choo ,  Baek-Kyun Jeon ,  Hyung-Woo Nam

IPC分类号： H01L2146

CPC分类号： C03B33/093 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B28D1/221 ,  H01L21/3043 ,  H01L21/78

摘要： A method and an apparatus for cutting a non-metallic substrate by a laser are disclosed. In the disclosed method and apparatus, a first laser beam for breaking molecular bonds of the non-metallic substrate material is scanned on a cutting path formed on the non-metallic substrate to form a scribe line having a crack in desired depth. Then, a second laser beam is scanned along a scanning path of the first laser beam to propagate the crack in a depth direction of the substrate and to completely separate the non-metallic substrate. Since the cutting speed can be controlled by the speed of the first laser beam, the cutting speed can be increased and the cutting speed can be easily controlled as compared with the conventional cutting method using the temperature difference due to the heating operation and the cooling operation.

公开(公告)号：US06541730B2

公开(公告)日：2003-04-01

申请号：US09978040

申请日：2001-10-17

申请人： Hyung-Woo Nam ,  Dae-Ho Choo ,  Baek-Kyun Jeon

发明人： Hyung-Woo Nam ,  Dae-Ho Choo ,  Baek-Kyun Jeon

IPC分类号： B23K2638

CPC分类号： C03B33/093 ,  B23K26/0736 ,  B23K26/146 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G02F1/133351 ,  H01L21/67092

摘要： Disclosed are an apparatus and a method for cutting a non-metal substrate. A laser device generates a first laser beam onto a cutting route formed in the non-metal substrate for heating the cutting route such that a scribe line is formed on the cutting route. The laser device also generates a second laser beam, which is spaced by a predetermined distance from the first laser beam, such that a beam pattern is formed along a radiating route of the first laser beam. A cooling device forms a crack by applying a cooling fluid beam onto the cutting route formed between the first laser beam and the second laser beam. After applying the cooling fluid beam, the non-metal substrate is cut by using one beam pattern, to simplify an optical system. A great tensile force is generated in the scribe line, so the thick non-metal substrate can be completely cut at once.