公开(公告)号：US08847104B2

公开(公告)日：2014-09-30

申请号：US13132835

申请日：2009-12-04

申请人： Zhongke Wang ,  Tao Chen ,  Hongyu Zheng

发明人： Zhongke Wang ,  Tao Chen ,  Hongyu Zheng

IPC分类号： B23K26/00 ,  B23K26/14 ,  B23K26/02 ,  B23K26/40 ,  H01L21/78

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  Y10T225/304

摘要： A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

摘要翻译： 提供了通过在晶片内产生裂纹来切割半导体晶片的方法及其系统。 该方法包括将激光束照射到晶片的表面并会聚激光束以形成焦点，从而形成由焦点限定的焦点体积和晶片内的激光束的边界。 包围在聚焦体积内的能量使位于聚焦体积周边的晶片比位于聚焦体积内的晶片收缩得更快，从而在晶片内产生裂纹。

公开(公告)号：US08269138B2

公开(公告)日：2012-09-18

申请号：US12469794

申请日：2009-05-21

申请人： Sean Matthew Garner ,  Xinghua Li

发明人： Sean Matthew Garner ,  Xinghua Li

IPC分类号： B23K26/00

CPC分类号： C03B33/091 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/52 ,  C03B33/0215 ,  C03B33/0235 ,  C03B33/04 ,  Y10T225/304

摘要： A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material with a laser beam that is substantially absorbed proximate the surface of the sheet to produce sub-sheets. In some embodiments, only a single pass of the laser beam over a surface of the sheet is necessary to separate the sheet. In other embodiments a plurality of passes may be used. Sub-sheets can be further processed into electronic devices by depositing thin film materials on the sub-piece.

摘要翻译： 公开了一种用于分离厚度等于或小于约1mm的脆性材料片的方法。 一旦产生初始缺陷或裂纹，全身裂纹可以通过激光束在脆性材料的尺寸上传播，激光束在片材表面附近基本上被吸收以产生子片。 在一些实施例中，仅需要片材表面上的激光束的单次通过来分离片材。 在其他实施例中，可以使用多个通路。 子片可以通过在子片上沉积薄膜材料而被进一步加工成电子器件。

公开(公告)号：US20110244659A1

公开(公告)日：2011-10-06

申请号：US13132835

申请日：2009-12-04

申请人： Zhongke Wang ,  Tao Chen ,  Hongyu Zheng

发明人： Zhongke Wang ,  Tao Chen ,  Hongyu Zheng

IPC分类号： H01L21/78 ,  B26F3/00

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  Y10T225/304

摘要： A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

摘要翻译： 提供了通过在晶片内产生裂纹来切割半导体晶片的方法及其系统。 该方法包括将激光束照射到晶片的表面并会聚激光束以形成焦点，从而形成由焦点限定的焦点体积和晶片内的激光束的边界。 包围在聚焦体积内的能量使位于聚焦体积周边的晶片比位于聚焦体积内的晶片收缩得更快，从而在晶片内产生裂纹。

公开(公告)号：US07642483B2

公开(公告)日：2010-01-05

申请号：US10541198

申请日：2003-12-18

申请人： Ki-Yong You ,  Choon-Taek Kim ,  Min-Young An ,  Mi-Jee Kim

发明人： Ki-Yong You ,  Choon-Taek Kim ,  Min-Young An ,  Mi-Jee Kim

IPC分类号： B23K26/14 ,  B23K26/42 ,  C03B33/09

CPC分类号： C03B33/093 ,  C03B33/102 ,  G02F1/133351 ,  Y10T225/304 ,  Y10T225/307 ,  Y10T225/321

摘要： A glass plate cutting machine using a laser beam is provided to solve problems, such as uneven glass section and slanting cutting. By using the glass plate cutting machine of the current invention, the glass plate is irradiated with a first carbon dioxide laser beam of 0.05-2 joule/mm2 on a long oval shaped area of 20-200 mm2 according to an expected cutting line thereof, and immediately cooled with water, to generate a scribe line, which is then further irradiated with a second carbon dioxide laser beam of 0.1-0.5 joule/mm′ on the area of 20-200 mm2 thus obtaining a superior glass section.

摘要翻译： 提供使用激光束的玻璃板切割机，以解决玻璃板不均匀和倾斜切割等问题。 通过使用本发明的玻璃板切割机，根据其预期的切割线，在20-200mm 2的长椭圆形区域上照射0.05-2焦耳/ mm 2的第一二氧化碳激光束， 立即用水冷却，生成划线，然后在20-200mm 2的面积上进一步用0.1-0.5焦耳/ mm 2的第二二氧化碳激光束照射，从而获得优良的玻璃部分。

公开(公告)号：US20080236199A1

公开(公告)日：2008-10-02

申请号：US10594935

申请日：2006-01-30

申请人： Vladislav Sklyarevich ,  Mykhaylo Shevelev

发明人： Vladislav Sklyarevich ,  Mykhaylo Shevelev

IPC分类号： C03B33/09

CPC分类号： C03B33/09 ,  C03B33/078 ,  Y10T225/12 ,  Y10T225/304

摘要： A method of high speed cutting of non-metallic materials (14), preferably glass and laminated glass, is described. In the inventive method a concentrated microwave radiation (1) with appropriate frequency and power density is chosen so as to accomplish heating of at least one selected area (2) of the body at the required separating propagation path (3) to required temperature in a selected short time while ensuring that this temperature is large enough to create a thermal stress (6) through the thickness of the selected area that results in the separating of the body material. In one embodiment of the invention a method of high speed cutting laminated glass is described wherein concentrated microwave radiation is used for delaminating adhesive film before the step of separating the glass body.

摘要翻译： 描述了非金属材料（14），优选玻璃和夹层玻璃的高速切割的方法。 在本发明的方法中，选择具有适当频率和功率密度的浓缩微波辐射（1），以便在所需的分离传播路径（3）中将至少一个所选体积的所选区域（2）加热至所需温度 选择的短时间，同时确保该温度足够大以通过导致主体材料分离的所选区域的厚度产生热应力（6）。 在本发明的一个实施例中，描述了一种高速切割夹层玻璃的方法，其中在分离玻璃体的步骤之前使用浓缩的微波辐射来分层粘合剂膜。

公开(公告)号：US20060201983A1

公开(公告)日：2006-09-14

申请号：US10551760

申请日：2004-10-25

申请人： Hideaki Kusama ,  Toshio Inami ,  Naoyuki Kobayashi

发明人： Hideaki Kusama ,  Toshio Inami ,  Naoyuki Kobayashi

IPC分类号： B26F3/00

CPC分类号： C03B33/093 ,  C03B33/076 ,  Y10T225/12 ,  Y10T225/304

摘要： According to the present invention, a first laser beam 2 and a second laser beam 3 composed of an ultraviolet laser are irradiated from a side of a second glass member 5b, allowing the first laser beam 2 to pass through the second glass member 5b so as to condense the first laser beam 2 on the first glass member 5a to form a first scribe line 14, condensing the second laser beam 3 on the second glass member 5b to form a second scribe line 15, and applying a break force to the first scribe line 14 and the second scribe line 15 to cut the glass.

摘要翻译： 根据本发明，从第二玻璃构件5b的一侧照射由紫外线激光器构成的第一激光束2和第二激光束3，使第一激光束2通过第二玻璃构件5b 以便将第一激光束2冷凝在第一玻璃部件5a上以形成第一划线14，将第二激光束3会聚在第二玻璃部件5b上以形成第二划线15，并施加断裂力 到第一划痕线14和第二划痕线15以切割玻璃。

公开(公告)号：US20060097022A1

公开(公告)日：2006-05-11

申请号：US11169857

申请日：2005-06-30

申请人： Jung Kim

发明人： Jung Kim

IPC分类号： B26F3/00

CPC分类号： C03B33/093 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/0838 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0094 ,  C03B33/033 ,  C03B33/07 ,  C03B33/091 ,  G02F1/133351 ,  Y02P40/57 ,  Y10T83/2192 ,  Y10T225/304 ,  Y10T225/321

摘要： A scribing apparatus simultaneously performs scribing processes for a TFT substrate and a C/F substrate in the same location, thereby efficiently utilizing equipment space and achieving enhanced productivity. A substrate cutting apparatus is equipped with the scribing apparatus, and a substrate cutting method uses the substrate cutting apparatus. The scribing apparatus includes a stage for attracting a first mother substrate including first and second conjoined substrates, a scribing belt for holding a second mother substrate including conjoined third and fourth substrates, and a head unit for forming cracks in the second substrate of the first mother substrate or in the third substrate of the second mother substrate.

摘要翻译： 划线装置同时对同一位置的TFT基板和C / F基板进行划片处理，从而有效地利用设备空间并提高生产率。 衬底切割装置配备有划线装置，并且基板切割方法使用基板切割装置。 划线装置包括用于吸引包括第一和第二结合基板的第一母基板的台，用于保持包括结合的第三和第四基板的第二母基板的划线带，以及用于在第一母线的第二基板中形成裂纹的头单元 衬底或第二母体衬底的第三衬底中。

公开(公告)号：US20060022008A1

公开(公告)日：2006-02-02

申请号：US10903701

申请日：2004-07-30

申请人： James Brown ,  Harry Menegus

发明人： James Brown ,  Harry Menegus

IPC分类号： B26F3/00

CPC分类号： C03B33/091 ,  B23K26/06 ,  B23K26/0738 ,  B23K26/0869 ,  B23K26/40 ,  B23K2103/50 ,  Y10T225/10 ,  Y10T225/304

摘要： The present invention relates to a process for laser scoring of flat glass sheets. The process comprises manipulating a laser beam having a substantially Gaussian intensity profile to produce an elongated heating zone on the glass sheet to be scored, the elongated heating zone having a central portion with a lower temperature than a temperature of an outer portion of the heating zone. An initial crack is made in the glass sheet, the elongated heating zone is traversed across the glass sheet coincident with the initial crack, and the heated glass is thermally shocked by directing a cooled liquid against the heated glass, thus propagating the crack. The scored glass sheet may thereafter be broken by applying bending techniques as are known in the art.

摘要翻译： 本发明涉及平板玻璃板的激光刻痕方法。 该方法包括操纵具有基本高斯强度分布的激光束，以在待刻划的玻璃板上产生细长的加热区，细长加热区具有温度低于加热区外部温度的中心部分 。 在玻璃板上进行初始裂纹，细长的加热区穿过与初始裂缝一致的玻璃板，并且通过将冷却的液体引导到加热的玻璃上而使加热的玻璃受到热冲击，从而传播裂纹。 然后，通过施加本领域已知的弯曲技术，可以破碎刻痕玻璃片。

公开(公告)号：US20050263503A1

公开(公告)日：2005-12-01

申请号：US10524982

申请日：2003-07-18

申请人： Rudolf Brzesowsky ,  Abraham Balkenende ,  Raymond Gijsbertus Van Agthoven ,  Petrus Timmermans ,  Nicolaas Willard

发明人： Rudolf Brzesowsky ,  Abraham Balkenende ,  Raymond Gijsbertus Van Agthoven ,  Petrus Timmermans ,  Nicolaas Willard

IPC分类号： B23K26/38 ,  B23K26/073 ,  B23K26/14 ,  B23K26/40 ,  B28D5/00 ,  C03B33/09 ,  C03B33/095 ,  B26F3/16

CPC分类号： B23K26/073 ,  B23K26/146 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  B28D5/0011 ,  C03B33/091 ,  Y10T225/12 ,  Y10T225/304

摘要： The invention relates to a method of breaking a substrate of a brittle material, the method comprising the steps of providing a substrate (1) of a brittle material, heating the substrate with a laser beam (3) to create a heated spot on the substrate, moving the laser beam and the substrate with respect to each other to create a line of heated spots on the substrate (2), cooling the heated spots on the substrate by locally applying a cooling medium (4) behind the heated spots such that a micro-crack is propagated in the line of heated spots, and breaking the substrate along the line of the propagated micro-cracks by applying a mechanical force on the substrate wherein, the cooling medium comprises an aqueous surfactant solution. The surfactants will connect to the broken siloxane bonds inside the surface cracks. Then recombination and healing of the broken siloxane bonds will not occur and the required breaking load will remain constant over time.

摘要翻译： 本发明涉及一种破碎脆性材料的基材的方法，所述方法包括以下步骤：提供脆性材料的基材（1），用激光束（3）加热基材以在基材上产生加热点 相对于彼此移动激光束和衬底以在衬底（2）上产生一线加热点，通过在加热点之后局部施加冷却介质（4）来冷却衬底上的加热点，使得 微裂纹在加热点的线中传播，并且通过在基底上施加机械力来破坏基底，沿着传播的微裂纹的线，其中冷却介质包含表面活性剂水溶液。 表面活性剂将连接到表面裂纹内的破裂的硅氧烷键。 然后，破裂的硅氧烷键的复合和愈合将不会发生，并且所需的断裂载荷随时间保持恒定。

公开(公告)号：US20050252943A1

公开(公告)日：2005-11-17

申请号：US11126733

申请日：2005-05-10

申请人： Kwang Yoo

发明人： Kwang Yoo

IPC分类号： G02F1/13 ,  B26F3/00 ,  B31B50/25 ,  C03B33/07 ,  C03B33/09 ,  C03B33/10

CPC分类号： C03B33/09 ,  C03B33/07 ,  C03B33/10 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T83/2024 ,  Y10T225/304

摘要： This invention relates to a scribing apparatus of a substrate that is adaptive for improving productivity as well as preventing the occurrence of substrate badness. A scribing apparatus according to an embodiment of the present invention includes a wheel to scribe a substrate; a refrigerant supplier installed near one side of the wheel to spray a refrigerant to the substrate; and a hot steam supplier installed near the other side of the wheel to spray a hot steam to the substrate.

摘要翻译： 本发明涉及一种适于提高生产率以及防止衬底不良发生的衬底划线装置。 根据本发明的实施例的划线装置包括：刻划基板的轮; 安装在所述车轮一侧附近的制冷剂供应器以将制冷剂喷射到所述基板; 以及安装在轮的另一侧附近的热蒸汽供应器以将热蒸汽喷射到基底。