公开(公告)号：US20250164707A1

公开(公告)日：2025-05-22

申请号：US18513147

申请日：2023-11-17

Applicant: GlobalFoundries U.S. Inc.

Inventor： Arpan Dasgupta ,  Kevin Dezfulian ,  Yusheng Bian ,  Norman Robson ,  Brittany Hedrick ,  Thomas Houghton ,  Kenneth J. Giewont ,  Koushik Ramachandran ,  Daniel W. Fisher

IPC: G02B6/42

Abstract: Structures for a photonics chip that enable external communication and methods of forming such structures. The structure comprises a spot-size converter, a body on a semiconductor substrate, and a dielectric layer on the semiconductor substrate. The body includes a surface adjacent to the spot-size converter and a reflector on the surface. The dielectric layer includes a recess disposed above the spot-size converter and the reflector.

公开(公告)号：US20240393523A1

公开(公告)日：2024-11-28

申请号：US18202337

申请日：2023-05-26

Applicant: GlobalFoundries U.S. Inc.

Inventor： Brittany Hedrick ,  Ian Melville ,  Michael David Webster ,  Harry Cox ,  Jorge Lubguban ,  Sarah Knickerbocker

IPC: F21V8/00 ,  G02B6/122

Abstract: Structures for a photonics chip that include a cavity or groove and methods of forming same. The structure comprises a semiconductor substrate including a first opening, a back-end-of-line stack on the semiconductor substrate, and a dielectric layer on the back-end-of-line stack. The back-end-of-line stack includes a pad, and the dielectric layer includes a second opening that extends to the pad. The structure further comprises an electrical interconnect inside the second opening in the dielectric layer. The electrical interconnect includes a sidewall that is separated in a lateral direction from the dielectric layer by a gap.