公开(公告)号：US20250164707A1

公开(公告)日：2025-05-22

申请号：US18513147

申请日：2023-11-17

Applicant: GlobalFoundries U.S. Inc.

Inventor： Arpan Dasgupta ,  Kevin Dezfulian ,  Yusheng Bian ,  Norman Robson ,  Brittany Hedrick ,  Thomas Houghton ,  Kenneth J. Giewont ,  Koushik Ramachandran ,  Daniel W. Fisher

IPC: G02B6/42

Abstract: Structures for a photonics chip that enable external communication and methods of forming such structures. The structure comprises a spot-size converter, a body on a semiconductor substrate, and a dielectric layer on the semiconductor substrate. The body includes a surface adjacent to the spot-size converter and a reflector on the surface. The dielectric layer includes a recess disposed above the spot-size converter and the reflector.

公开(公告)号：US20240413603A1

公开(公告)日：2024-12-12

申请号：US18206181

申请日：2023-06-06

Applicant: GlobalFoundries U.S. Inc.

Inventor： Scott Pozder ,  Daniel W. Fisher ,  John Malinowski

IPC: H01S5/0232 ,  H01S5/02345 ,  H01S5/0236 ,  H01S5/0237

Abstract: Structures including a photonics chip and a cavity-mounted laser chip, and methods of forming and using such structures. The structure comprises a photonics chip including a substrate and a cavity in the substrate. The structure further comprises a laser chip inside the cavity, and a lead frame comprising a first section attached to a portion of the laser chip and a second section attached to a portion of the photonics chip.