公开(公告)号：US20190342672A1

公开(公告)日：2019-11-07

申请号：US16475328

申请日：2017-10-25

Applicant: GOERTEK INC.

Inventor： Mengjin CAI ,  Junkai ZHAN

IPC: H04R19/04 ,  H04R7/16 ,  H04R7/04

Abstract: The present invention provides a condenser microphone, comprising a substrate, and a back plate and a vibrating diaphragm which are arranged on the substrate; the back plate is arranged on the upper side and/or the lower side of the vibrating diaphragm; and the vibrating diaphragm is provided with a protruding layer or a corrugated membrane structure layer. With the above invention, the area of the vibrating diaphragm and the capacitance at the lateral side of the condenser microphone can be increased, so as to achieve the effect of improving the sensitivity of the condenser microphone.

公开(公告)号：US20180356255A1

公开(公告)日：2018-12-13

申请号：US15781352

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： Junkai ZHAN ,  Mengjin CAI

IPC: G01D5/241

CPC classification number: G01D5/2417 ,  B81B2201/0214 ,  B81B2201/0221 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/053 ,  B81C1/00182 ,  B81C1/00214 ,  G01K7/34 ,  G01L9/0045 ,  G01L9/0047 ,  G01L9/0073

Abstract: An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.

公开(公告)号：US20190028814A1

公开(公告)日：2019-01-24

申请号：US15743509

申请日：2017-05-25

Applicant: Goertek Inc.

Inventor： Junkai ZHAN ,  Mengjin CAI ,  Zonglin ZHOU

IPC: H04R19/04 ,  H04R7/04 ,  H04R7/18

CPC classification number: H04R19/04 ,  B06B1/0292 ,  G10K9/12 ,  H04R1/2823 ,  H04R7/04 ,  H04R7/18 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003 ,  H04R2207/021

Abstract: An MEMS microphone is disclosed, which comprises a substrate and a vibrating diaphragm and a back electrode which are located above the substrate, a plurality of comb tooth parts are formed in edge positions of the vibrating diaphragm, and the plurality of comb tooth parts are distributed in a peripheral direction of the vibrating diaphragm at intervals, wherein a position between every two adjacent comb tooth parts on the vibrating diaphragm is connected to the substrate via an insulating layer; and the comb tooth parts on the vibrating diaphragm are at least partially overlapped with the substrate, and a clearance exists between the comb tooth parts and the substrate and is configured as an airflow circulation channel. The microphone of the present invention has better impact resistance and can avoid intrusion of dust.

公开(公告)号：US20180362331A1

公开(公告)日：2018-12-20

申请号：US15739913

申请日：2017-03-03

Applicant: Goertek Inc.

Inventor： Junkai ZHAN ,  Zonglin ZHOU ,  Guanxun Qiu ,  Mengjin CAI

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B2201/02 ,  B81C1/00261 ,  B81C3/001

Abstract: A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

公开(公告)号：US20180359571A1

公开(公告)日：2018-12-13

申请号：US15781364

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： Junkai ZHAN ,  Mengjin CAI ,  Guanxun QIU ,  Zonglin ZHOU ,  Qinglin SONG

IPC: H04R19/04 ,  B81C1/00 ,  B81B7/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B7/0029 ,  B81B7/02 ,  B81B2201/0257 ,  B81B2201/0292 ,  B81C1/00158 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

Abstract: An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.