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公开(公告)号：US20240255483A1
公开(公告)日：2024-08-01
申请号：US18490881
申请日：2023-10-20
Applicant: Brown University
Inventor： Jacob K. ROSENSTEIN , Christopher ROSE
CPC classification number: G01N33/0075 , B81B3/0018 , B81B2201/0264 , B81B2201/0278
Abstract: A system includes an array of chemical, pressure, and temperature sensors, and a temporal airflow modulator configured to provide sniffed vapors in a temporally-modulated sequence through a plurality of different air paths across multiple sensor locations.
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公开(公告)号：US20240124300A1
公开(公告)日：2024-04-18
申请号：US18397930
申请日：2023-12-27
Applicant: STMicroelectronics, Inc.
Inventor： Jefferson Sismundo TALLEDO
CPC classification number: B81C1/00309 , B81B7/0061 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/07 , B81C2201/0108 , B81C2201/0143 , B81C2201/0146
Abstract: A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.
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公开(公告)号：US20240118141A1
公开(公告)日：2024-04-11
申请号：US18391769
申请日：2023-12-21
Applicant: PixArt Imaging Incorporation
Inventor： Chih-Ming Sun , Ming-Han Tsai
IPC: G01J5/02 , A61B5/00 , A61B5/01 , B81B7/00 , B81B7/02 , G01J5/00 , G01J5/04 , G01J5/14 , G01K13/20 , H04N23/56
CPC classification number: G01J5/0265 , A61B5/01 , A61B5/681 , B81B7/0025 , B81B7/0061 , B81B7/02 , G01J5/0025 , G01J5/027 , G01J5/04 , G01J5/046 , G01J5/14 , G01K13/20 , H04N23/56 , A61B5/02416 , B81B2201/0214 , B81B2201/0235 , B81B2201/0242 , B81B2201/0278 , H01L2224/48091 , H01L2924/16151 , H01L2924/16153 , H01L2924/16235
Abstract: The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on apart of a user's body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.
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公开(公告)号：US20230375416A1
公开(公告)日：2023-11-23
申请号：US18228333
申请日：2023-07-31
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Tsai-Hao HUNG , Shih-Chi KUO
CPC classification number: G01K7/32 , B81C1/00944 , B81B3/0008 , B81B2203/0136 , B81C2201/0105 , B81C2201/013 , B81C2201/0116 , B81B2201/0278 , B81B2203/04
Abstract: The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.
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公开(公告)号：US20230314229A1
公开(公告)日：2023-10-05
申请号：US18330371
申请日：2023-06-07
Applicant: PIXART IMAGING INC.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHENG-NAN TSAI
CPC classification number: G01J5/0265 , G01J5/041 , H04N5/33 , G01J5/045 , G01J5/06 , B81B7/0064 , B81B7/0067 , H04N23/57 , B81B2201/0278
Abstract: A wearable device includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the wearable device. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.
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Patent Agency Ranking
公开(公告)号：US11718519B2
公开(公告)日：2023-08-08
申请号：US17102973
申请日：2020-11-24
Applicant: STMicroelectronics S.r.l.
Inventor： Marco Omar Ghidoni
CPC classification number: B81B7/0058 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81B2207/092
Abstract: A packaged environmental sensor includes a supporting structure and a sensor die, which incorporates an environmental sensor and is arranged on a first side of the supporting structure. A control chip is coupled to the sensor die and is arranged on a second side of the supporting structure opposite to the first side. A lid is bonded to the first side of the supporting structure and is open towards the outside in a direction opposite to the supporting structure. The sensor die is housed within the lid.
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公开(公告)号：US20190071663A1
公开(公告)日：2019-03-07
申请号：US16175500
申请日：2018-10-30
Applicant: Purigen Biosystems, Inc.
Inventor： Lewis A. MARSHALL , Amy L. HIDDESSEN , Nathan P. HOVERTER , Klint A. ROSE , Juan G. Santiago
IPC: C12N15/10 , C12Q1/6806 , G01N27/447
CPC classification number: C12N15/101 , B01L3/502753 , B01L2300/0627 , B01L2300/0867 , B81B1/004 , B81B7/0087 , B81B2201/0278 , B81B2201/05 , B81B2203/0338 , C12N15/10 , C12Q1/6806 , G01N27/44704 , G01N27/4473 , G01N27/44739 , G01N27/44791 , G01N27/44795 , C12Q2565/125
Abstract: The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.
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公开(公告)号：US20180074000A1
公开(公告)日：2018-03-15
申请号：US15808408
申请日：2017-11-09
Applicant: STMicroelectronics S.r.l.
Inventor： Pasquale Biancolillo , Angelo Recchia , Pasquale Franco , Antonio Cicero , Giuseppe Bruno
CPC classification number: G01N27/18 , B81B7/02 , B81B7/04 , B81B2201/02 , B81B2201/0278 , G01N30/66 , G01N33/0027
Abstract: A semiconductor gas sensor device includes a first cavity that is enclosed by opposing first and second semiconductor substrate slices. At least one conducting filament is provided to extend over the first cavity, and a passageway is provided to permit gas to enter the first cavity. The sensor device may further including a second cavity that is hermetically enclosed by the opposing first and second semiconductor substrate slices. At least one another conducting filament is provided to extend over the second cavity.
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公开(公告)号：US09796580B2
公开(公告)日：2017-10-24
申请号：US14738745
申请日：2015-06-12
Applicant: InvenSense, Inc.
Inventor： Peter Smeys , Martin Lim
IPC: B81B7/00
CPC classification number: B81B7/007 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/0278 , B81B2203/0315 , B81B2207/012 , B81C1/00238 , B81C2203/0785 , B81C2203/0792 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2924/00014 , H01L2924/00012
Abstract: A sensor chip combining a substrate comprising at least one CMOS circuit, a MEMS substrate and another substrate comprising at least one CMOS circuit in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit. Where the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate. The second surface of the MEMS substrate is attached to the second substrate. The first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical inter-connects.
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10.发明申请公开(公告)号：US20170203960A1
公开(公告)日：2017-07-20
申请号：US15327902
申请日：2015-08-20
Applicant: CSMC TECHNOLOGIES FAB1 CO., LTD.
Inventor： Errong JING
CPC classification number: B81B7/02 , B81B2201/0278 , B81B2203/0118 , B81C1/00 , B81C1/0015 , B81C2201/0197 , G01J1/04 , G01J1/42 , G01J5/024 , G01J5/0853
Abstract: A method for manufacturing a MEMS double-layer suspension microstructure comprises steps of: forming a first film body on a substrate, and a cantilever beam connected to the substrate and the first film body; forming a sacrificial layer on the first film body and the cantilever beam; patterning the sacrificial layer located on the first film body to manufacture a recessed portion used for forming a support structure, the bottom of the recessed portion being exposed of the first film body; depositing a dielectric layer on the sacrificial layer; patterning the dielectric layer to manufacture a second film body and the support structure, the support structure being connected to the first film body and the second film body; and removing the sacrificial layer to obtain the MEMS double-layer suspension microstructure.
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