摘要:
An analog circuit architecture with dual gate oxides and dual voltage supplies and associated method is provided. In the analog circuit architecture, different kinds of devices/transistors with different gate oxide thicknesses are powered by different voltages, such that advantages of each device technology are mixed to enhance total performance of the analog circuit. For example, thin gate oxide 0.18 um transistors are powered by 1.8V for high speed and low power consumption, whereas thick gate oxide 0.35 um transistors are powered by 3.3V for a wider signal swing range.
摘要:
An analog circuit architecture is fabricated with dual gate oxides and dual voltage supplies. In the analog circuit architecture, different kinds of devices/transistors with different gate oxide thicknesses are biased by different voltages, such that advantages of each device technology are mixed to enhance total performance of the analog circuit. For example, thin oxide 0.18 um transistors are biased at 1.8V for higher speed and lower power consumption, whereas thick oxide 0.35 um transistors are biased at 3.3V for a wider signal swing range.
摘要:
An integrated circuit package includes a lead frame having a plurality of leads and a metal layer; an integrated circuit die having a plurality of power-level bond pads; a plurality of first bond wires electrically connected between the power-level bond pads and the metal layer, respectively; and a second bond wire electrically connected between the metal layer and a lead of the lead frame.