公开(公告)号：US20170295676A1

公开(公告)日：2017-10-12

申请号：US15511237

申请日：2014-09-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin D CONN ,  Kelly K SMITH ,  Kapil Rao Papa Rao Bala GANTA, Sr.

IPC: H05K7/20

Abstract: A chassis in accordance with one example includes a plurality of slots to receive a plurality of top-loading computing cartridges from a top of the chassis. The chassis also includes a supply inlet on a first side of the chassis to direct cooling fluid from the first side to a second side of the chassis, and a return outlet on the second side of the chassis to expel the cooling fluid from the chassis. The plurality of computing cartridges are immersed in the cooling fluid.

公开(公告)号：US20170202099A1

公开(公告)日：2017-07-13

申请号：US15316776

申请日：2014-07-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Minh H NGUYEN ,  Keith A SAUER ,  Kelly K SMITH

IPC: H05K5/02 ,  H05K5/03 ,  E05B5/00 ,  E05C19/10 ,  E05B65/02 ,  E05B13/10

CPC classification number: H05K5/0221 ,  E05B5/00 ,  E05B13/10 ,  E05B65/02 ,  E05C3/047 ,  E05C19/10 ,  G06F1/181 ,  H05K5/023 ,  H05K5/03

Abstract: A latch assembly includes a lever and a cover. The lever includes a main portion, a cam portion, and an end portion. The cam portion includes a first cam surface and a second cam surface. The lever rotates between an install hood position and an uninstall hood position. The cover couples the lever and the hood. The cover includes a cavity to receive the lever.

公开(公告)号：US20170265334A1

公开(公告)日：2017-09-14

申请号：US15329574

申请日：2014-08-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Joseph Anthony OLIVER ,  Kelly K SMITH ,  Keith A SAUER ,  James Jeffery SCHULZE

IPC: H05K7/20 ,  F04D29/60 ,  F04D29/40 ,  G06F1/20 ,  F04D25/16

Abstract: Example implementations relate to a fan module assembly. One example fan module assembly includes a basepan housed in a chassis of a computing device. The basepan includes a distal end. The fan module assembly also includes a plurality of pins extending from the basepan. The plurality of pins includes a first pin and a second pin. The first pin and the second pin are staggered with respect to a plane defined by the distal end. The fan module assembly further includes a fan module attached to the basepan via the first pin and the second pin.

公开(公告)号：US20160366792A1

公开(公告)日：2016-12-15

申请号：US15120515

申请日：2014-05-28

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kelly K SMITH ,  Richard A BARGERHUFF ,  Rachel Nicole POLLOCK ,  Kapil Rao GANTA PAPA RAO BALA

IPC: H05K7/20 ,  G05D7/06

CPC classification number: H05K7/20781 ,  G05D7/0635 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20772 ,  H05K7/2079 ,  H05K7/20836

Abstract: Examples herein disclose a multiple tier cooling structure. The multiple tier cooling structure includes multiple tanks, multiple inlets, and multiple outlets. Each of the multiple tanks are on a respective tier, each of the multiple inlets are located on a first side at each tank to direct a cooling fluid from the first side of each tank to a second side. Each of the multiple outlets are located on the second side at each tank to direct an expulsion of the cooling fluid from each tank.

Abstract translation: 本文的实例公开了多层冷却结构。 多层冷却结构包括多个罐，多个入口和多个出口。 多个罐中的每一个在相应的层上，每个多个入口位于每个罐的第一侧，以将冷却流体从每个罐的第一侧引导到第二侧。 多个出口中的每一个位于每个罐的第二侧，以引导来自每个罐的冷却流体的排出。