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公开(公告)号：US10888022B2
公开(公告)日：2021-01-05
申请号：US16066409
申请日：2016-03-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Fu-Yi Chen
Abstract: In one example, an electronic device is described, which includes a cooling element and a controller coupled to the cooling element. The controller may detect environmental data and system operating data of the electronic device during a period of time, obtain a user input associated with an acceptable noise level for the cooling element, and control the cooling element based on the environmental data, the system operating data, and the acceptable noise level of the cooling element.
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公开(公告)号：US20190041901A1
公开(公告)日：2019-02-07
申请号：US16051032
申请日：2018-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： John William Pennington, JR. , Fu-Yi Chen , ShuChun Hsiao , Daniel Young Yoon , Insun Hong , Will Macia
IPC: G06F1/16
Abstract: A wearable computing device mount may include a harness wearable by a user; a plate attached to the harness, wherein a computing device is selectively mounted to the plate via mechanical fasteners, the plate including a plurality of stanchions to separate a back side of the plate from the harness; and a docking station, the docking station to communicatively couple to the computing device.
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公开(公告)号：US20220206548A1
公开(公告)日：2022-06-30
申请号：US17599828
申请日：2019-07-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Hsiang Chuan Sung , Chien Hao Chen , Fu-Yi Chen , Yi-Hsuan Huang , Chi-feng Chen
Abstract: An example non-transitory machine-readable storage medium includes instructions to determine whether a cooling fan is controlled by pulse wave modulation (PWM) or is voltage-controlled. When executed, the instructions cause a processor of a computing device to transmit first and second PWM test signals at different PWM duties to a fan connector connected to the cooling fan, receive a first and second fan speed signals in response, and determine, when the first fan speed signal is not equal to the second fan speed signal, that the cooling fan is a PWM-controlled fan. The instructions further cause the processor to transmit first and second voltage test signals at different voltages to the fan connector, receive a third fan and fourth speed signal in response, and determine, when the third fan speed signal is not equal to the fourth fan speed signal, that the cooling fan is a voltage-controlled fan.
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公开(公告)号：US20250142764A1
公开(公告)日：2025-05-01
申请号：US18497265
申请日：2023-10-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Fu-Yi Chen , Yu-Shi Wang
Abstract: The present disclosure provides an air duct structure to receive a processing component. The air duct structure includes an air inlet opening, an air outlet opening, a plurality of side walls, and a support surface. The air inlet opening is in direct fluid communication with an air inlet of the computer chassis. The air outlet opening is in direct fluid communication with an air inlet of a processing component. The plurality of side walls at least partially define a channel extending between the air inlet opening and the air outlet opening. The support surface receives the processing component on the air duct structure relative to the computer chassis. The processing component includes an air exhaust to diffuse air, and the plurality of side walls at least partially fluidly isolate the air inlet opening from an air diffused from the air exhaust.
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公开(公告)号：US20240081014A1
公开(公告)日：2024-03-07
申请号：US18262152
申请日：2021-01-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Fu-Yi Chen , Jui-Ming Chien
CPC classification number: H05K7/1402 , H05K7/2039
Abstract: In some examples, a device can include a locking mechanism to couple the device to a computing device enclosure, a first portion at a first level to interact with a processor back-plate, and a second portion at a second level to interact with an area proximate to the processor back-plate, wherein the second portion protrudes to the second level toward the processor back-plate when the device is coupled to the computing device enclosure.
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Patent Agency Ranking
公开(公告)号：US20220205690A1
公开(公告)日：2022-06-30
申请号：US17606074
申请日：2019-07-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Fu-Yi Chen
Abstract: A device to thermoelectrically cool a cooling fluid is described. The device includes a cooling fluid circulation system to circulate a cooling fluid which cools a hardware component of a computer. The device further includes a thermoelectric cooling unit to cool the cooling fluid. The device further includes a controller to execute temperature control instructions to control the thermoelectric cooling unit to cool the cooling fluid to a cooling temperature not lower than ambient temperature to reduce the risk of water condensation.
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公开(公告)号：US10754380B2
公开(公告)日：2020-08-25
申请号：US16051032
申请日：2018-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： John William Pennington, Jr. , Fu-Yi Chen , ShuChun Hsiao , Daniel Young Yoon , Insun Hong , Will Macia
IPC: G06F1/16
Abstract: A wearable computing device mount may include a harness wearable by a user; a plate attached to the harness, wherein a computing device is selectively mounted to the plate via mechanical fasteners, the plate including a plurality of stanchions to separate a back side of the plate from the harness; and a docking station, the docking station to communicatively couple to the computing device.
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公开(公告)号：US20190008074A1
公开(公告)日：2019-01-03
申请号：US16066409
申请日：2016-03-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Fu-Yi Chen
Abstract: In one example, an electronic device is described, which includes a cooling element and a controller coupled to the cooling element. The controller may detect environmental data and system operating data of the electronic device during a period of time, obtain a user input associated with an acceptable noise level for the cooling element, and control the cooling element based on the environmental data, the system operating data, and the acceptable noise level of the cooling element.
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公开(公告)号：US20230013869A1
公开(公告)日：2023-01-19
申请号：US17786609
申请日：2019-12-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chi-Hsuan Hung , Fu-Yi Chen
Abstract: Examples of back covers for devices are described. In an example, the back cover includes an air-vent, and a region of a surface of the back cover directing air dispensed by a cooling unit of the device toward the air-vent.
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公开(公告)号：US10001140B2
公开(公告)日：2018-06-19
申请号：US14802125
申请日：2015-07-17
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Fu-Yi Chen
IPC: F04D29/58
CPC classification number: F04D29/582
Abstract: Example implementations relate to a fan cover with a plurality of openings. For example, a device may include a fan cover to a fan device and a heat conduction device, a portion of the heat conduction device being coupled to an inside surface of the fan cover. The fan cover provides airflow for heat dissipation in a computing device and surrounds at least a portion of the fan device. The fan device has a first side associated with an axis about which an impeller of the fan device is capable of rotating and a second side associated with blade edges of the impeller of the fan device. The fan cover includes a flat portion to surround the first side and a curved portion to surround the second side, the curved portion having a plurality of openings such that airflow produced by the fan device is capable of passing through.
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