公开(公告)号：US20210383524A1

公开(公告)日：2021-12-09

申请号：US17410344

申请日：2021-08-24

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Shuyang DOU ,  Shinichi SHINODA ,  Yasutaka TOYODA ,  Hiroyuki SHINDO

IPC: G06T7/00 ,  G06T7/73 ,  G06T7/13 ,  G06T7/80 ,  G06N20/00 ,  G06T7/11

Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.

公开(公告)号：US20200074611A1

公开(公告)日：2020-03-05

申请号：US16557175

申请日：2019-08-30

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Shuyang DOU ,  Shinichi SHINODA ,  Yasutaka TOYODA ,  Hiroyuki SHINDO

IPC: G06T7/00 ,  G06T7/73 ,  G06T7/13 ,  G06T7/80 ,  G06T7/11 ,  G06N20/00

Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.

公开(公告)号：US20170336717A1

公开(公告)日：2017-11-23

申请号：US15536255

申请日：2015-12-18

Applicant: Hitachi High-Technologies Corporation

Inventor： Shinichi SHINODA ,  Yasutaka TOYODA ,  Hiroyuki USHIBA ,  Hitoshi SUGAHARA

IPC: G03F7/20

Abstract: The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.

公开(公告)号：US20190228522A1

公开(公告)日：2019-07-25

申请号：US16252061

申请日：2019-01-18

Applicant: Hitachi High-Technologies Corporation

Inventor： Shinichi SHINODA ,  Masayoshi ISHIKAWA ,  Yasutaka TOYODA ,  Yuichi ABE ,  Hiroyuki SHINDO

IPC: G06T7/00 ,  G06N20/00 ,  G06K9/20 ,  G06K9/03

Abstract: The image evaluation device includes a design data image generation unit that images design data; a machine learning unit that creates a model for generating a design data image from an inspection target image, using the design data image as a teacher and using the inspection target image corresponding to the design data image; a design data prediction image generation unit that predicts the design data image from the inspection target image, using the model created by the machine learning unit; a design data image generation unit that images the design data corresponding to the inspection target image; and a comparison unit that compares a design data prediction image generated by the design data prediction image generation unit and the design data image. As a result, it is possible to detect a systematic defect without using a defect image and generating misinformation frequently.

公开(公告)号：US20170160082A1

公开(公告)日：2017-06-08

申请号：US15321667

申请日：2015-06-17

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Shinichi SHINODA ,  Yasutaka TOYODA ,  Hiroyuki USHIBA ,  Hitoshi SUGAHARA

IPC: G01B15/04 ,  G03F7/20 ,  H01J37/28

CPC classification number: G01B15/04 ,  G01B2210/56 ,  G03F7/70625 ,  G03F7/70641 ,  H01J37/28 ,  H01J2237/2817 ,  H01L21/027

Abstract: The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition. To achieve the purpose, proposed is a pattern measurement condition setting device which sets a pattern measurement condition when the measurement of a pattern is executed, and is provided with an arithmetic unit which selects a pattern having a predetermined condition from pattern information for each exposure condition obtained when the exposure condition of a reduced projection exposure device is changed or pattern information for each exposure condition obtained when the exposure condition is changed by optical simulation, the arithmetic unit selecting a pattern as an object to be measured or a candidate for the object to be measured, the change of the size or shape of the pattern with respect to the change of the exposure condition satisfying a predetermined condition, and the number of patterns having the same shape as that of the pattern satisfying a predetermined condition.