公开(公告)号：US20150351285A1

公开(公告)日：2015-12-03

申请号：US14612934

申请日：2015-02-03

申请人： HUAWEI TECHNOLOGIES CO., LTD. ,  WASEDA UNIVERSITY

发明人： Suguru NODA ,  Nuri NA ,  Mizuhisa NIHEI

IPC分类号： H05K7/20 ,  C23C16/26 ,  C23C14/34 ,  C01B31/02

CPC分类号： H05K7/20509 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B2202/08 ,  C23C16/0272 ,  C23C16/26 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  Y10S977/722 ,  Y10S977/843 ,  Y10S977/902 ,  H01L2924/00

摘要： A heat dissipation structure and a synthesizing method thereof are provided by the present disclosure. The method comprises: providing a metal foil; forming a deposition substrate on a first surface of the metal foil, wherein the deposition substrate includes a barrier layer disposed on the metal foil and a catalyst layer disposed on the barrier layer, such that catalyst in the catalyst layer is prevented from diffusing into the metal foil; and synthesizing a carbon nanotube array on the deposition substrate formed on the first surface. The method provided by the present disclosure can increase density of the CNTs in the heat dissipation structure.

摘要翻译： 散热结构及其合成方法由本发明提供。 该方法包括：提供金属箔; 在金属箔的第一表面上形成沉积衬底，其中沉积衬底包括设置在金属箔上的阻挡层和设置在阻挡层上的催化剂层，使得催化剂层中的催化剂不被扩散到金属中 挫败; 以及在形成在第一表面上的沉积基板上合成碳纳米管阵列。 通过本公开提供的方法可以增加散热结构中的CNT的密度。

公开(公告)号：US20220283349A1

公开(公告)日：2022-09-08

申请号：US17750023

申请日：2022-05-20

申请人： Huawei Technologies Co., Ltd. ,  TOHOKU UNIVERSITY

发明人： Mizuhisa NIHEI ,  Feng YU ,  Yoshiaki KANAMORI

IPC分类号： G02B5/28

摘要： A wavelength selective filter comprises a multi-layered structure alternately having a low refractive index layer and a high refractive index layer, a periodic structure layer facing the low refractive index layer of the multi-layered structure, the low refractive index layer having a refractive index between 1.30 and 1.60 and a thickness between 100 nm and 800 nm, the high refractive index layer having a refractive index between 1.70 and 2.20 and a thickness between 30 nm and 100 nm, and in a plane perpendicular to a thickness direction of the periodic structure layer, the multi-layered structure layer having a periodic structure made of metal or semiconductor.

公开(公告)号：US20180179429A1

公开(公告)日：2018-06-28

申请号：US15890164

申请日：2018-02-06

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Mizuhisa NIHEI ,  Xiaosong ZHOU ,  Keishin OTA

IPC分类号： C09K5/14 ,  F28F3/00 ,  F28F21/02

CPC分类号： C09K5/14 ,  B82Y30/00 ,  B82Y40/00 ,  F28F3/00 ,  F28F21/02 ,  H01L23/373 ,  H01L23/3735 ,  Y10S977/742 ,  Y10S977/843

摘要： A thermal interface material, a method for preparing a thermal interface material, a thermally conductive pad, and a heat dissipation system are provided. In one example, the thermal interface material includes a metal zirconium coil and carbon nanotube arrays, where the metal zirconium coil has a first surface and a second surface that is opposite to the first surface. The carbon nanotubes in the carbon nanotube arrays are distributed on the first surface and the second surface. Further, the first surface and the second surface of the metal zirconium coil include exposed metal zirconium. Therefore, interface thermal resistance of the thermal interface material is reduced, and a heat conducting property of the thermal interface material is improved.