Abstract:
The invention concerns electrical wire which has been wrapped with insulating tape using as a sealant a compound of the following chemical formula:
WHERE N IS GREATER THAN ONE. The polymer is the reaction product of 3,3'',4,4''-tetraaminobenzophenone and a 3,3'',4,4''-tetraester of benzophenone tetracarboxylic acid. Wire which has been wrapped according to this invention has improved electrical properties and high temperature stability.
Abstract:
THIS DISCLOSURE DESCRIBES A METHOD OF PROVIDING SELFCURING AND CURED HYDRIXYLATED OR NONHYDROXYLATED POLYAROMATICS OR POLYARYLENES SUCH AS POLYHENYLENES, POLYPHENOLPHENYLENES, POLYPHENYLSILANES, AND POLYPHENYLETHERS, AND MIXTURES THEREOF WHICH ARE PREPARED FROM CORRESPONDING AROMATIC HYDROCARBONS OR MIXTURES OF PHENOLS WITH SUCH AROMATIC HYDROCARBONS AND AROMATIC MANNICH BASES USING A STRONG PROTONIC OR NON-PROTONIC ACID, FOR EXAMPLE, STRONG LEWIS ACID CATALYSTS. THE CURED POLYMERS EXHIBIT IMPROVED ADHESION CHARACTERISTS, AND PROVIDE COMPOSITIONS WITH IMPROVED STRENGTH. THE DISCLOSURE MORE PARTICULARLY DESCRIBES THE METHOD OF PREPARATION OF IMPROVED CURABLE AND CURED PRODUCTS, OF SAID POLYAROMATIC POLYMERS PARTIALLY CURED AND THE CURING THEREOF WITH AROMATIC MANNICH BASES OF POLY(A-(DIALKYLAMINOMETHYL))PHENYL, OR HOMOLOGOUS BIPHENYL, TERPHENYL OR PHENOL DERIVATIVES, ISOMERS OF SAME, AND MIXTURES THEREOF, WITH AN ACID MATERIAL.
Abstract:
This invention is concerned with an improved polyimide which makes an excellent electrical insulation for metal conductors. It may be used as the insulating layer around the periphery of the metal conductor or as an adhesive for tape used as the insulating layer. The invention is also concerned with a novel prepolymer which is essentially a polyamide in structure and which is readily curable to the corresponding polyimide. The prepolymer is prepared by reacting a tetraalkyl ester of benzophenone tetracarboxylic acid or its anhydride with 1,3-bis(paminophenoxy)benzene.
Abstract:
1. A COMPOUND HAVING THE FORMULA CHEMICAL STRUCTURE:
HC*C-R''-((-CO-N(-)-CO-)>R" CO-)>R" WHEREIN R IS POLY(ARYLENE ETHER) OR POLY(ARYLENE THIOETHER), R'' IS ARYLENE OR DIARYLENE ETHER, N IS AN AVERAGE FROM 1 TO ABOUT 10, AND R" IS
Abstract:
Polyphenylene resin compositions of fused and non-fused aromatic ring compounds containing an aromatic curing agent in combination with other resinous modifying and forming material, with or without insoluble polymers, and method.
Abstract:
IMPROVED THERMOSETTING BONDED SOLID LUBRICANTS COMPRISING ESSENTIALLY A POLYMER RESIN OF OVER 90% CARBON AND PEFERABLY POLYPHENYLENE POLYMERS OF AT LEAST ABOUT 94% CARBON BONDING OF SOLID LUBRICANT PARTICULATES, COMPOSITIONS THEREFOR AND METHOD.