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1.发明授权公开(公告)号：US08841159B2
公开(公告)日：2014-09-23
申请号：US13500685
申请日：2010-09-27
CPC分类号： H01L33/507 , H01L33/38 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.
摘要翻译： 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。
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2.发明申请公开(公告)号：US20120193669A1
公开(公告)日：2012-08-02
申请号：US13500685
申请日：2010-09-27
CPC分类号： H01L33/507 , H01L33/38 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.
摘要翻译： 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。
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