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公开(公告)号:US11523544B2
公开(公告)日:2022-12-06
申请号:US15774300
申请日:2016-02-16
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Zheila N. Madanipour , William K. Norton , Wade D. Vinson
Abstract: In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.
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公开(公告)号:US10983293B1
公开(公告)日:2021-04-20
申请号:US16805593
申请日:2020-02-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Kevin B. Leigh , Everett R. Salinas , Wade D. Vinson
Abstract: Hot-pluggable optical modules for high-density optical signaling are provided. The modules comprise a dual-purpose heat spreader configured to function as a thermal component and including trenches accommodating optical infrastructure. The dual-purpose heat spreader includes a trench for routing optical fibers to and from a plurality of optical connectors, each disposed on a branch of the fiber harness assembly and configured to mate with a socket on a module board through an opening in the dual-purpose heat spreader.
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公开(公告)号:US20200260617A1
公开(公告)日:2020-08-13
申请号:US15774300
申请日:2016-02-16
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Zheila N. Madanipour , William K. Norton , Wade D. Vinson
Abstract: In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.
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公开(公告)号:US20180067524A1
公开(公告)日:2018-03-08
申请号:US15562063
申请日:2015-04-20
Applicant: Hewlett Packard Enterprise Development LP
Inventor: David A. Moore , John p. Franz , Wade D. Vinson
IPC: G06F1/20 , H05K7/20 , H01L23/467 , H01L23/40
CPC classification number: G06F1/20 , G06F1/203 , G06F2200/201 , H01L23/40 , H01L23/467 , H01L2023/4062 , H05K7/20736
Abstract: In one implementation, a system for supplemental air cooling includes a heat sink mounted to a computing device, a supplemental cooling device coupled to the heat sink by a number of heat pipes, and a fan coupled to the supplemental cooling device.
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