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公开(公告)号：US20100055878A1
公开(公告)日：2010-03-04
申请号：US12618292
申请日：2009-11-13
申请人： Hiroshi MAKI , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人： Hiroshi MAKI , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号： H01L21/304
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。
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公开(公告)号：US07629231B2
公开(公告)日：2009-12-08
申请号：US11735741
申请日：2007-04-16
申请人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。
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公开(公告)号：US08703583B2
公开(公告)日：2014-04-22
申请号：US12618292
申请日：2009-11-13
申请人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。
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公开(公告)号：US20070275544A1
公开(公告)日：2007-11-29
申请号：US11735741
申请日：2007-04-16
申请人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。
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