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10 条记录 (耗时 0.031 秒)

    Foreign Substance Removing Device and Die Bonder Equipped with the Same
    5.
    发明申请
    Foreign Substance Removing Device and Die Bonder Equipped with the Same 有权
    异物去除装置及其配套的贴片机

    公开(公告)号：US20120241096A1

    公开(公告)日：2012-09-27

    申请号：US13224536

    申请日：2011-09-02

    申请人： Takashi YAMAGAMI ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

    发明人： Takashi YAMAGAMI ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

    IPC分类号： B32B38/00 ,  B08B5/04 ,  B08B5/02

    CPC分类号： H01L21/67028 ,  H01L21/67144 ,  H01L24/75 ,  H01L2924/10253 ,  Y10T156/14 ,  H01L2924/00

    摘要： The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same.The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

    摘要翻译： 本发明的目的是提供一种异物移除装置，其能够快速有效地清洁基板表面，而不管其尺寸如何，并且防止一次去除的异物的再粘合以及提供装备有该物质的模具接合机。 本发明的异物清除装置包括：固定有其上载有模具的切割膜的拾取装置; 以及用于拾取与切割膜分离的模具的夹头，并将模具放置在其上施加有粘合剂的基板上，并且用于去除衬底上的异物以准备将粘合剂施加到基板上。 异物去除装置包括集成空气出口孔和空气入口孔的清洁喷嘴。

    Foreign substance removing device and die bonder equipped with the same
    6.
    发明授权
    Foreign substance removing device and die bonder equipped with the same 有权
    异物除去装置和管芯接合装置

    公开(公告)号：US08783319B2

    公开(公告)日：2014-07-22

    申请号：US13224536

    申请日：2011-09-02

    申请人： Takashi Yamagami ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

    发明人： Takashi Yamagami ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

    IPC分类号： B32B38/10

    CPC分类号： H01L21/67028 ,  H01L21/67144 ,  H01L24/75 ,  H01L2924/10253 ,  Y10T156/14 ,  H01L2924/00

    摘要： The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same.The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

    摘要翻译： 本发明的目的是提供一种异物移除装置，其能够快速有效地清洁基板表面，而不管其尺寸如何，并且防止一次去除的异物的再粘合以及提供装备有该物质的模具接合机。 本发明的异物清除装置包括：固定有其上载有模具的切割膜的拾取装置; 以及用于拾取与切割膜分离的模具的夹头，并将模具放置在其上施加有粘合剂的基板上，并且用于去除衬底上的异物以准备将粘合剂施加到基板上。 异物去除装置包括集成空气出口孔和空气入口孔的清洁喷嘴。

    Semiconductor thin film formed on a supporting substrate
    8.
    发明授权
    Semiconductor thin film formed on a supporting substrate 失效
    形成在支撑基板上的半导体薄膜

    公开(公告)号：US5646432A

    公开(公告)日：1997-07-08

    申请号：US57987

    申请日：1993-05-05

    申请人： Tadao Iwaki ,  Tsuneo Yamazaki ,  Katsuki Matsushita ,  Shigeru Senbonmatsu ,  Ryuichi Takano

    发明人： Tadao Iwaki ,  Tsuneo Yamazaki ,  Katsuki Matsushita ,  Shigeru Senbonmatsu ,  Ryuichi Takano

    IPC分类号： G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  G06E3/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/304 ,  H01L21/336 ,  H01L21/762 ,  H01L27/12 ,  H01L29/78 ,  H01L29/786 ,  H01L27/01 ,  H01L23/48 ,  H01L29/00 ,  H01L31/032

    CPC分类号： G02F1/13454 ,  G06E3/003 ,  H01L21/2007 ,  H01L27/1203 ,  G02F2202/105

    摘要： A semiconductor substrate is provided which has a semiconductor on insulator structure but in which can be formed a thin film integrated circuit having electrical characteristics and microstructure equal to or of greater density than a silicon integrated circuit formed using a bulk single crystal silicon wafer. The semiconductor substrate has a structure which is formed of a sequentially layered single crystal silicon thin film sandwiched between a thermally oxidized silicon film and a silicon oxide or silicon nitride film, an element smoothing layer, a fluoro-epoxy series resin adhesive layer, and a supporting substrate. The single crystal silicon thin film can have integrated circuit devices formed in a sub-micron geometry similar to that of a bulk single crystal silicon. A transparent glass or a bulk single crystal silicon wafer can be used as a supporting substrate. Therefore the semiconductor thin film can integrate a highly fine, dense and compact semiconductor integrated circuit or semiconductor optical element. The semiconductor thin film element has a transparent optical detection region or optical modulation region with 100 million pixels or more.

    摘要翻译： 提供了半导体衬底，其具有半导体绝缘体结构，但是其中可以形成具有等于或者比具有大体积单晶硅晶片形成的硅集成电路更高密度的电特性和微结构的薄膜集成电路。 半导体衬底具有由夹在热氧化硅膜和氧化硅或氮化硅膜之间的顺序层叠的单晶硅薄膜，元件平滑层，氟 - 环氧树脂粘合剂层和 支撑衬底。 单晶硅薄膜可以具有类似于大块单晶硅的亚微米几何形状的集成电路器件。 可以使用透明玻璃或块状单晶硅晶片作为支撑基板。 因此，半导体薄膜可以集成高精度，致密和紧凑的半导体集成电路或半导体光学元件。 半导体薄膜元件具有1亿像素以上的透明光检测区域或光调制区域。

    Light valve device
    9.
    发明授权
    Light valve device 失效
    光阀装置

    公开(公告)号：US6067062A

    公开(公告)日：2000-05-23

    申请号：US749292

    申请日：1991-08-23

    申请人： Hiroaki Takasu ,  Yoshikazu Kojima ,  Masaaki Kamiya ,  Tsuneo Yamazaki ,  Hiroshi Suzuki ,  Masaaki Taguchi ,  Ryuichi Takano ,  Satoru Yabe

    发明人： Hiroaki Takasu ,  Yoshikazu Kojima ,  Masaaki Kamiya ,  Tsuneo Yamazaki ,  Hiroshi Suzuki ,  Masaaki Taguchi ,  Ryuichi Takano ,  Satoru Yabe

    IPC分类号： G02F1/1337 ,  G02F1/136 ,  G02F1/1362 ,  G09G3/20 ,  G09G3/36 ,  G09G5/00 ,  H01L27/12

    CPC分类号： G02F1/13454 ,  G02F1/13378 ,  G09G3/3648 ,  H01L27/1214 ,  H01L27/1251 ,  G02F1/136213 ,  G02F2202/105 ,  G09G2330/02 ,  G09G5/006

    摘要： A light valve has a composite substrate comprised of an electrically insulating substrate and a semiconductor single crystal thin film formed over the electrically insulating substrate. A pixel array comprising semiconductor switch elements is formed in the semiconductor single crystal thin film. A peripheral circuit having circuit elements is formed in the semiconductor single crystal thin film so that a small-sized, high speed light valve is obtained. X- driver and Y-driver circuits are formed in the semiconductor single crystal thin film and controlled by a control circuit, such as a video signal processing circuit, which receives and processes video signals inputted directly from an external source. The peripheral circuit can be a DRAM sense amplifier for sensing charges stored in each pixel of the pixel array to detect defects in the pixel array. The peripheral circuit can be a photosensor circuit for detecting an intensity of incident light to monitor the performance of a light source of the light valve. The peripheral circuit can be a temperature sensor for detecting the temperature of a liquid crystal layer of the light valve, and may be comprised of Darlington connected NPN transistors formed in the semiconductor single crystal thin film. The peripheral circuit can also be a solar cell for converting incident light into electrical energy to supply power to at least one of the pixel array, X-driver and Y-driver circuits and the peripheral circuit.

    摘要翻译： 光阀具有由电绝缘基板和形成在电绝缘基板上的半导体单晶薄膜构成的复合基板。 包含半导体开关元件的像素阵列形成在半导体单晶薄膜中。 在半导体单晶薄膜中形成具有电路元件的外围电路，从而获得小型高速光阀。 X驱动器和Y驱动器电路形成在半导体单晶薄膜中，并由诸如视频信号处理电路的控制电路控制，该电路接收并处理从外部源直接输入的视频信号。 外围电路可以是用于感测存储在像素阵列的每个像素中的电荷的DRAM读出放大器，以检测像素阵列中的缺陷。 外围电路可以是用于检测入射光的强度以监视光阀的光源的性能的光电传感器电路。 外围电路可以是用于检测光阀的液晶层的温度的温度传感器，并且可以由形成在半导体单晶薄膜中的达林顿连接的NPN晶体管组成。 外围电路也可以是用于将入射光转换为电能以向像素阵列，X驱动器和Y驱动器电路和外围电路中的至少一个供电的太阳能电池。