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公开(公告)号:US20100055878A1
公开(公告)日:2010-03-04
申请号:US12618292
申请日:2009-11-13
申请人: Hiroshi MAKI , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人: Hiroshi MAKI , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号: H01L21/304
CPC分类号: H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要: A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译: 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线,其形成在真空夹头的底面,并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说,真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空,当芯片从切割胶带脱离并传送到布线基板上的安装位置时,该真空提供吸力。 第二个管道为抽真空筒提供一个真空,当芯片安装在布线基板上时,该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度(吸力)。
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公开(公告)号:US07629231B2
公开(公告)日:2009-12-08
申请号:US11735741
申请日:2007-04-16
申请人: Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人: Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号: H01L21/00
CPC分类号: H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要: A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译: 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线,其形成在真空夹头的底面,并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说,真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空,当芯片从切割胶带脱离并传送到布线基板上的安装位置时,该真空提供吸力。 第二个管道为抽真空筒提供一个真空,当芯片安装在布线基板上时,该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度(吸力)。
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公开(公告)号:US08703583B2
公开(公告)日:2014-04-22
申请号:US12618292
申请日:2009-11-13
申请人: Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人: Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号: H01L21/00
CPC分类号: H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要: A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译: 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线,其形成在真空夹头的底面,并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说,真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空,当芯片从切割胶带脱离并传送到布线基板上的安装位置时,该真空提供吸力。 第二个管道为抽真空筒提供一个真空,当芯片安装在布线基板上时,该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度(吸力)。
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公开(公告)号:US20070275544A1
公开(公告)日:2007-11-29
申请号:US11735741
申请日:2007-04-16
申请人: Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人: Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号: H01L21/00
CPC分类号: H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要: A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译: 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线,其形成在真空夹头的底面,并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说,真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空,当芯片从切割胶带脱离并传送到布线基板上的安装位置时,该真空提供吸力。 第二个管道为抽真空筒提供一个真空,当芯片安装在布线基板上时,该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度(吸力)。
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公开(公告)号:US08222050B2
公开(公告)日:2012-07-17
申请号:US13208171
申请日:2011-08-11
申请人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
发明人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
IPC分类号: H01L21/00
CPC分类号: H01L21/77 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L22/12 , H01L22/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T156/1132 , Y10T156/1944 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01032 , H01L2924/01031 , H01L2924/3512
摘要: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.
摘要翻译: 在半导体集成电路器件的制造期间的组装工艺中的切割之后的芯片拾取工艺中,减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地,由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中,为了解决这些问题,在通过夹紧夹头对芯片进行真空夹持的情况下,在从切割带(胶带)等剥离芯片的情况下,夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。
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公开(公告)号:US20080318346A1
公开(公告)日:2008-12-25
申请号:US12137522
申请日:2008-06-11
申请人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
发明人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
IPC分类号: H01L21/66
CPC分类号: H01L21/77 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L22/12 , H01L22/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T156/1132 , Y10T156/1944 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01032 , H01L2924/01031 , H01L2924/3512
摘要: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.
摘要翻译: 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中,减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地,由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中,为了解决这些问题,在通过夹紧夹头对芯片进行真空夹持的情况下,在从切割带(胶带)等剥离芯片的情况下,夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。
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公开(公告)号:US08003495B2
公开(公告)日:2011-08-23
申请号:US12987779
申请日:2011-01-10
申请人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
发明人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
IPC分类号: H01L21/00
CPC分类号: H01L21/77 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L22/12 , H01L22/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T156/1132 , Y10T156/1944 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01032 , H01L2924/01031 , H01L2924/3512
摘要: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.
摘要翻译: 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中,减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地,由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中,为了解决这些问题,在通过夹紧夹头对芯片进行真空夹持的情况下,在从切割带(胶带)等剥离芯片的情况下,夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。
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公开(公告)号:US20110097849A1
公开(公告)日:2011-04-28
申请号:US12987779
申请日:2011-01-10
申请人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
发明人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
IPC分类号: H01L21/50
CPC分类号: H01L21/77 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L22/12 , H01L22/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T156/1132 , Y10T156/1944 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01032 , H01L2924/01031 , H01L2924/3512
摘要: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.
摘要翻译: 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中,减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地,由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中,为了解决这些问题,在通过夹紧夹头对芯片进行真空夹持的情况下,在从切割带(胶带)等剥离芯片的情况下,夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。
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公开(公告)号:US08372665B2
公开(公告)日:2013-02-12
申请号:US13533963
申请日:2012-06-26
申请人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
发明人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
IPC分类号: H01L21/00
CPC分类号: H01L21/77 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L22/12 , H01L22/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T156/1132 , Y10T156/1944 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01032 , H01L2924/01031 , H01L2924/3512
摘要: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.
摘要翻译: 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中,减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地,由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中,为了解决这些问题,在通过夹紧夹头对芯片进行真空夹持的情况下,在从切割带(胶带)等剥离芯片的情况下,夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。
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公开(公告)号:US07888141B2
公开(公告)日:2011-02-15
申请号:US12137522
申请日:2008-06-11
申请人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
发明人: Hiroshi Maki , Tsuyoshi Yokomori , Tatsuyuki Okubo
IPC分类号: H01L21/00
CPC分类号: H01L21/77 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L22/12 , H01L22/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T156/1132 , Y10T156/1944 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01032 , H01L2924/01031 , H01L2924/3512
摘要: In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.
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