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公开(公告)号：US20100055878A1
公开(公告)日：2010-03-04
申请号：US12618292
申请日：2009-11-13
申请人： Hiroshi MAKI , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人： Hiroshi MAKI , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号： H01L21/304
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。
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公开(公告)号：US07629231B2
公开(公告)日：2009-12-08
申请号：US11735741
申请日：2007-04-16
申请人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。
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公开(公告)号：US08703583B2
公开(公告)日：2014-04-22
申请号：US12618292
申请日：2009-11-13
申请人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。
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公开(公告)号：US20070275544A1
公开(公告)日：2007-11-29
申请号：US11735741
申请日：2007-04-16
申请人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
发明人： Hiroshi Maki , Masayuki Mochizuki , Ryuichi Takano , Yoshiaki Makita , Haruhiko Fukasawa , Keisuke Nadamoto , Tatsuyuki Okubo
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L21/68742 , H01L21/78 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01032 , H01L2924/00 , H01L2924/3512
摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.
摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。
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公开(公告)号：US07824932B2
公开(公告)日：2010-11-02
申请号：US12436647
申请日：2009-05-06
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , H01L21/67132 , H01L21/67271 , H01L24/45 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.
摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。
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公开(公告)号：US20080057599A1
公开(公告)日：2008-03-06
申请号：US11850503
申请日：2007-09-05
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , H01L21/67132 , H01L21/67271 , H01L24/45 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.
摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。
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公开(公告)号：US20100285615A1
公开(公告)日：2010-11-11
申请号：US12840333
申请日：2010-07-21
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , H01L21/67132 , H01L21/67271 , H01L24/45 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.
摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。
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公开(公告)号：US08367433B2
公开(公告)日：2013-02-05
申请号：US12840333
申请日：2010-07-21
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , H01L21/67132 , H01L21/67271 , H01L24/45 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.
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公开(公告)号：US20090215204A1
公开(公告)日：2009-08-27
申请号：US12436647
申请日：2009-05-06
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , H01L21/67132 , H01L21/67271 , H01L24/45 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.
摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。
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公开(公告)号：US09099524B2
公开(公告)日：2015-08-04
申请号：US13224511
申请日：2011-09-02
申请人： Yoshiaki Makita , Shingo Fukasawa
发明人： Yoshiaki Makita , Shingo Fukasawa
IPC分类号： H01L23/00
CPC分类号： H01L24/75 , H01L24/32 , H01L24/83 , H01L2224/27312 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/32225 , H01L2224/32245 , H01L2224/75611 , H01L2224/75753 , H01L2224/83192 , H01L2224/8385 , H01L2924/014 , H01L2924/0665 , H01L2924/00015 , H01L2924/00
摘要： A die bonder that eliminates the need for moving a recognition camera for capturing an image related to adhesive application and achieves high reliability with high throughput is disclosed. The die bonder includes a lead frame; a syringe located above the lead frame and enclosing therein a paste adhesive; a recognition camera lateral to the syringe; an illumination lamp disposed in the vicinity of the recognition camera; and a reflector plate disposed opposite the illumination lamp. The reflector plate is adapted to reflect light from the illumination lamp onto the lead frame at an application surface of the paste adhesive. The recognition camera, illumination lamp, and reflector plate are arranged in a manner that the reflector plate is disposed on −Y side and the recognition camera and the illumination lamp are disposed on +Y side with respect to the syringe located above the lead frame transported in X direction.
摘要翻译： 公开了一种芯片焊接机，其不需要移动用于捕获与粘合剂应用相关的图像的识别相机，并以高通量实现高可靠性。 芯片焊接机包括引线框架; 位于引线框架上方的注射器，并在其中封装有糊状粘合剂; 注射器侧面的识别摄像机; 配置在识别照相机附近的照明灯; 以及与照明灯相对设置的反射板。 所述反射板适于在所述糊状粘合剂的使用表面处将来自所述照明灯的光反射到所述引线框架上。 识别照相机，照明灯和反射板以反射板设置在-Y侧，并且识别照相机和照明灯相对于位于引导框架上方的注射器位于+ Y侧 在X方向。
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