WIRELESS CHARGER
    1.
    发明申请

    公开(公告)号:US20220256732A1

    公开(公告)日:2022-08-11

    申请号:US17579770

    申请日:2022-01-20

    Abstract: The wireless charger includes a housing, a circuit board component, and a heat conduction structure. The housing has a first air inlet and a first air outlet, and a heat dissipation air channel that communicates with the first air inlet and the first air outlet and that is located inside the housing. is formed between the first air inlet and the first air outlet. The circuit board component is located in the heat dissipation air channel. The heat conduction structure includes a contact part and a connection part that are connected to each other, at least a part of the contact part is exposed to an outer surface of the housing, the contact part is configured to be in contact with a to-be-charged device, and the connection part is located inside the housing and is in contact with the heat dissipation air channel.

    POWER ADAPTER AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220338371A1

    公开(公告)日:2022-10-20

    申请号:US17711843

    申请日:2022-04-01

    Abstract: A power adapter and a manufacturing method thereof are provided. The power adapter includes a housing, a circuit board assembly, and a first heat dissipation part. There is accommodation space inside the housing, a line interface is disposed at a first end of the housing, and a power connector is disposed at a second end of the housing. The circuit board assembly is disposed in the accommodation space, and the circuit board assembly is electrically connected to the line interface and the power connector. The first heat dissipation part coats the outside of the circuit board assembly, and there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing.

    POWER ADAPTER
    3.
    发明申请

    公开(公告)号:US20220256733A1

    公开(公告)日:2022-08-11

    申请号:US17665225

    申请日:2022-02-04

    Abstract: A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.

    HEAT EXCHANGER, CABINET, AND COMMUNICATIONS BASE STATION

    公开(公告)号:US20220316806A1

    公开(公告)日:2022-10-06

    申请号:US17710481

    申请日:2022-03-31

    Abstract: A heat exchanger includes a vapor collection pipe, a liquid collection pipe, and an exchange pipeline. The exchange pipeline includes a condensing section, an evaporation section, and a transition section. An upper end of the condensing section is connected to the vapor collection pipe. A lower end of the condensing section is connected to a first end of the transition section. An upper end of the evaporation section is connected to a second end of the transition section. A lower end of the evaporation section is connected to the liquid collection pipe. The evaporation section and the condensing section respectively extend in directions opposite to each other.

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