公开(公告)号：US20250167717A1

公开(公告)日：2025-05-22

申请号：US19030039

申请日：2025-01-17

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yankun Xu ,  Lele Zhao

IPC: H02P29/024

Abstract: This application provides a motor controller, a drive circuit, a power device. The motor controller includes a bridge arm circuit and a drive circuit. The bridge arm circuit includes a plurality of switching transistor bridge arms. The drive circuit is configured to provide a plurality of drive voltages to a plurality of switching transistors of the bridge arm circuit respectively. The drive circuit includes a plurality of transformers, a primary-side switch, and a control unit. A primary-side winding of each transformer includes a primary-side primary winding and a primary-side feedback winding. A secondary-side winding of each transformer is configured to output one drive voltage. One end of each primary-side primary winding is configured to connect to a power supply. The other end of each primary-side primary winding is connected to an end of the primary-side switching transistor. The motor controller reduces structural complexity of the drive circuit.

公开(公告)号：US11862531B2

公开(公告)日：2024-01-02

申请号：US17668158

申请日：2022-02-09

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yankun Xu ,  Yue Chen ,  Yang Zhao ,  Ruoyang Du

IPC: H01L23/40 ,  H05K1/02

CPC classification number: H01L23/4006 ,  H05K1/0204 ,  H05K1/0209 ,  H01L2023/405 ,  H05K2201/066

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.

公开(公告)号：US20220270952A1

公开(公告)日：2022-08-25

申请号：US17668158

申请日：2022-02-09

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yankun Xu ,  Yue Chen ,  Yang Zhao ,  Ruoyang Du

IPC: H01L23/40 ,  H05K1/02

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.

公开(公告)号：US20240380349A1

公开(公告)日：2024-11-14

申请号：US18652385

申请日：2024-05-01

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yankun Xu ,  Lifei Bai ,  Yihe Wang

IPC: H02P27/06 ,  H02J3/00

Abstract: In accordance with an embodiment, a motor controller includes a power supply control circuit, a safety state control circuit, and switching bridge arms. The power supply control circuit is configured to control a backup power supply to supply power to the safety state control circuit. The backup power supply includes a flyback conversion circuit. The power supply control circuit is configured to: in response to an output voltage of a main power supply being greater than or equal to a second preset voltage and a bus voltage being greater than a first preset voltage, control the flyback conversion circuit to stop operating.