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1.发明申请Waterproof Structure of Pad, Waterproof Pad, and Method for Forming Waterproof Structure 审中-公开垫片防水结构，防水垫，防水结构方法公开(公告)号：US20140045372A1
公开(公告)日：2014-02-13
申请号：US14058419
申请日：2013-10-21
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jun Wang , Junlin Zou , Xiaowei Zou
CPC classification number: H01R13/5213 , H01L24/03 , H01L24/05 , H01L2224/02126 , H01L2224/02166 , H01L2224/05095 , H01L2224/05096 , H01L2224/05558 , H01L2924/01023 , H01L2924/01033 , H01L2924/12041 , H01L2924/14 , H01R43/005 , Y10T29/49204 , H01L2924/00
Abstract: The present invention discloses a waterproof structure of a pad, a waterproof pad, and a method for forming the waterproof structure. The waterproof structure includes a first dielectric layer, having an annular hollowed-out recess along the periphery of the first dielectric layer and a metal annular zone formed in the annular hollowed-out recess, and a second dielectric layer, formed above the first dielectric layer and located under the pad and having multiple first through-holes along the periphery of the second dielectric layer and multiple metal posts formed in the multiple first through-holes, where the multiple first through-holes form a hollow annular through-hole chain and the metal annular zone maintains an electrical connection with the multiple metal posts.
Abstract translation: 本发明公开了一种垫的防水结构，防水垫，以及防水结构的形成方法。 防水结构包括：第一电介质层，具有沿着第一电介质层的周边的环形中空凹槽和形成在环形中空凹槽中的金属环形区，以及第二电介质层，形成在第一介电层 并且位于所述垫下方并且具有沿着所述第二介电层的周边的多个第一通孔和形成在所述多个第一通孔中的多个金属柱，其中所述多个第一通孔形成中空的环形通孔链，并且 金属环形区域与多个金属柱保持电连接。
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公开(公告)号：US10069236B2
公开(公告)日：2018-09-04
申请号：US14058419
申请日：2013-10-21
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jun Wang , Junlin Zou , Xiaowei Zou
Abstract: The present invention discloses a waterproof structure of a pad, a waterproof pad, and a method for forming the waterproof structure. The waterproof structure includes a first dielectric layer, having an annular hollowed-out recess along the periphery of the first dielectric layer and a metal annular zone formed in the annular hollowed-out recess, and a second dielectric layer, formed above the first dielectric layer and located under the pad and having multiple first through-holes along the periphery of the second dielectric layer and multiple metal posts formed in the multiple first through-holes, where the multiple first through-holes form a hollow annular through-hole chain and the metal annular zone maintains an electrical connection with the multiple metal posts.
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