公开(公告)号：US20210255746A1

公开(公告)日：2021-08-19

申请号：US17261467

申请日：2018-07-20

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jinyan HU ,  Linfang JIN ,  Siyang LI

IPC: G06F3/0482 ,  G06F3/0481 ,  G06F3/0488 ,  H04N5/232 ,  G06F1/3203 ,  G06F1/20

Abstract: An application control method and an electronic device are provided. The method includes: The electronic device displays a first user interface of a first application, where the first user interface has N graphical controls; and the electronic device updates the first user interface if a temperature of the electronic device is less than or equal to a first preset temperature, so that an updated first user interface has less than N graphical controls, where N is a natural number greater than 1. In this manner, when the electronic device has a relatively low temperature, a user may be restricted from using some functions of an application.

公开(公告)号：US20220256740A1

公开(公告)日：2022-08-11

申请号：US17732684

申请日：2022-04-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yongfu SUN ,  Jian SHI ,  Zhi YUAN ,  Linfang JIN ,  Jie YANG

IPC: H05K7/20

Abstract: This application relates to a temperature equalization component and an electronic device. The temperature equalization component may include a housing and a capillary structure. The housing may include a cavity, and the capillary structure is located in the cavity and is disposed on a side that is of the housing and that faces a heating element. The housing is provided with a first protrusion part and/or a first depression part, and the temperature equalization component is in direct contact with the heating element by using the first protrusion part and/or the first depression part, thereby improving heat transfer efficiency, reducing a probability that heat accumulates around the heating element, and improving a heat dissipation effect of the temperature equalization component.

公开(公告)号：US20240008167A1

公开(公告)日：2024-01-04

申请号：US18254737

申请日：2021-11-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lan LI ,  Linfang JIN ,  Jinyan HU

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0206 ,  H05K1/144 ,  H05K2201/042

Abstract: An example heat dissipation apparatus is connected to a heat sink. The example heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The support post is connected between the first circuit board and the second circuit board to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The thermal conductive assembly is connected between a second thermal conductive layer of the first circuit board and a third thermal conductive layer of the second circuit board.

公开(公告)号：US20230018137A1

公开(公告)日：2023-01-19

申请号：US17954203

申请日：2022-09-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhi YUAN ,  Jian SHI ,  Hanru YU ,  Linfang JIN

IPC: G06F1/16 ,  G06F1/20

Abstract: Example mobile terminals are disclosed. One example terminal includes a rotating member, a flexible screen, a bending support part, and a temperature equalization plate. The flexible screen includes two unfolded regions and a bent region that is disposed opposite to the rotating member. The bending support part is located between the flexible screen and the rotating member. The temperature equalization plate is configured to balance temperatures in the two unfolded regions and includes two temperature equalization parts opposite to the two unfolded regions in a one-to-one correspondence and a flexible connection part that connects the two temperature equalization parts. The flexible connection part is located on a side of the bending support part and away from the flexible screen.

公开(公告)号：US20190394905A1

公开(公告)日：2019-12-26

申请号：US16337052

申请日：2017-09-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang JIN ,  Guo YANG ,  Shuainan LIN

IPC: H05K7/20

Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

公开(公告)号：US20190075683A1

公开(公告)日：2019-03-07

申请号：US16175703

申请日：2018-10-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yan XU ,  Linfang JIN

IPC: H05K7/20 ,  F28F21/02 ,  B32B9/00

Abstract: A heat sink, which includes a first surface and a second surface opposite to the first surface, where the second surface includes a plurality of sub-surfaces, and each sub-surface is configured to be in contact with a surface of a heat emitting element; the plurality of sub-surfaces include a first sub-surface, a thickness between the first sub-surface and the first surface is less than a thickness between the first surface and each of the plurality of sub-surfaces except the first sub-surface; and the heat sink includes a plurality of layers of graphene sheets, each layer of graphene sheet includes a plurality of flake graphite particles, and two adjacent flake graphite particles located in a same layer of graphene sheet are covalently bonded.

公开(公告)号：US20170220082A1

公开(公告)日：2017-08-03

申请号：US15508890

申请日：2014-06-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang JIN ,  Nanbo KANG ,  Jie ZOU ,  Xiaowei HUI

IPC: G06F1/20 ,  F28D15/04 ,  F28D15/02

CPC classification number: G06F1/203 ,  F28D15/0241 ,  F28D15/0275 ,  F28D15/04 ,  H01L23/34 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20 ,  H01L2924/00

Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.