公开(公告)号：US20210222919A1

公开(公告)日：2021-07-22

申请号：US17224539

申请日：2021-04-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xing Fu ,  Chengpeng Yang ,  Ningjun Zhu ,  Quanming Li

IPC: F25B21/02 ,  H01L23/38 ,  H01L35/04 ,  H01S5/024 ,  H01S5/06

Abstract: A thermoelectric cooler (TEC) configured to support a heat source device and perform temperature control on the heat source device. The TEC includes a first base plate, a second base plate disposed opposite to the first base plate, and first elements. The first base plate is configured to support the heat source device. An accommodation space is formed between the first base plate and the second base plate. The first elements are arranged at intervals within the accommodation space, and are all connected to the first base plate and the second base plate.

公开(公告)号：US20180187930A1

公开(公告)日：2018-07-05

申请号：US15907975

申请日：2018-02-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xing Fu ,  Chengpeng Yang ,  Ningjun Zhu ,  Quanming Li

IPC: F25B21/02 ,  H01S5/024 ,  H01L35/04 ,  H01L23/38 ,  H01S5/06

CPC classification number: F25B21/02 ,  H01L23/38 ,  H01L35/04 ,  H01S5/02415 ,  H01S5/0612

Abstract: A thermoelectric cooler (TEC) configured to support a heat source device and perform temperature control on the heat source device. The TEC includes a first base plate, a second base plate disposed opposite to the first base plate, and first elements. The first base plate is configured to support the heat source device. An accommodation space is formed between the first base plate and the second base plate. The first elements are arranged at intervals within the accommodation space, and are all connected to the first base plate and the second base plate.