公开(公告)号：US10426036B2

公开(公告)日：2019-09-24

申请号：US16192018

申请日：2018-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Songlin Li ,  Pengbo Tian ,  Qingyun Wang ,  Liang Xu

IPC: H03F3/22 ,  H05K1/18 ,  H05K3/34

Abstract: A power tube connection structure includes a substrate, a printed circuit board, and a power tube, where a through groove allowing the power tube to pass through is cut into the printed circuit board, a mounting groove is cut into the upper surface of the substrate at a location corresponding to the through groove, one end of the power tube extends through the through groove, and is welded onto a bottom face of the mounting groove, the end of the power tube that extends into the mounting groove abuts onto a side wall of the mounting groove close to an output end of the power amplifier, and a solder flux escape channel is made into the side wall of the mounting groove close to the output end of the power amplifier.

公开(公告)号：US20140345932A1

公开(公告)日：2014-11-27

申请号：US14457433

申请日：2014-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingli Huang ,  Tao Feng ,  Songlin Li

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/144 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/10242

Abstract: Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

Abstract translation: 本公开的实施例涉及电子领域，特别是涉及多层印刷电路板及其制造方法。 电路板能够避免信号传输性能受镀层孔影响的问题。 多层印刷电路板包括至少两层粘合的芯板，其中电路机械部件设置在芯板上，在芯板上还设有通孔，并且金属柱嵌入在通孔中 其中金属柱的一端连接到设置在芯板上的天线馈线电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 核心板。 该方法用于制造多层印刷电路板。

公开(公告)号：US09510449B2

公开(公告)日：2016-11-29

申请号：US14457433

申请日：2014-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingli Huang ,  Tao Feng ,  Songlin Li

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/14 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/144 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/10242

Abstract: Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

Abstract translation: 本公开的实施例涉及电子领域，特别是涉及多层印刷电路板及其制造方法。 电路板能够避免信号传输性能受镀层孔影响的问题。 多层印刷电路板包括至少两层粘合的芯板，其中电路机械部件设置在芯板上，在芯板上还设有通孔，并且金属柱嵌入在通孔中 其中金属柱的一端连接到设置在芯板上的天线馈线电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 核心板。 该方法用于制造多层印刷电路板。

公开(公告)号：US11086131B2

公开(公告)日：2021-08-10

申请号：US16577809

申请日：2019-09-20

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jian Ou ,  Ying Liang ,  Songlin Li

IPC: G02B27/01

Abstract: A near-eye display and a near-eye display system are provided. The near-eye display includes a display panel, a collimation lens component, and an optical redirector. The display panel includes a plurality of pixels that are disposed in a tiling manner. The collimation lens component includes a plurality of collimation lenses, and the plurality of collimation lenses are in a one-to-one correspondence with the plurality of pixels. Each of the plurality of collimation lenses is configured to: convert, into collimated light, light emitted by a corresponding pixel, and input the collimated light into the optical redirector. The optical redirector includes a plurality of light convergence structures, and the plurality of light convergence structures are in a one-to-one correspondence with the plurality of collimation lenses. Each of the plurality of light convergence structures is configured to converge, on a focus of the near-eye display, collimated light input by a corresponding collimation lens.

公开(公告)号：US10165687B2

公开(公告)日：2018-12-25

申请号：US15676352

申请日：2017-08-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Songlin Li ,  Pengbo Tian ,  Qingyun Wang ,  Liang Xu

IPC: H05K1/18 ,  H03F3/22 ,  H05K3/34

Abstract: A power tube connection structure includes a substrate, a printed circuit board, and a power tube, where a through groove allowing the power tube to pass through is cut into the printed circuit board, a mounting groove is cut into the upper surface of the substrate at a location corresponding to the through groove, one end of the power tube extends through the through groove, and is welded onto a bottom face of the mounting groove, the end of the power tube that extends into the mounting groove abuts onto a side wall of the mounting groove close to an output end of the power amplifier, and a solder flux escape channel is made into the side wall of the mounting groove close to the output end of the power amplifier.

公开(公告)号：US09857943B2

公开(公告)日：2018-01-02

申请号：US15011179

申请日：2016-01-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Songlin Li ,  Liu Yang

IPC: G06F3/048 ,  G06F3/0481 ,  G06F3/0488 ,  G06F3/16

CPC classification number: G06F3/04817 ,  G06F3/017 ,  G06F3/0304 ,  G06F3/0481 ,  G06F3/0484 ,  G06F3/04842 ,  G06F3/0488 ,  G06F3/04883 ,  G06F3/167

Abstract: A method for managing a task on a terminal device and the terminal device are provided. The method for managing a task on a terminal device may include: monitoring whether a first application on the terminal device is running, and monitoring a user's action of operating a desktop of the terminal device; and displaying, on the desktop of the terminal device, a running-state icon corresponding to the first application if it is detected that the first application is running, and disabling the first application if it is detected that the first application is running and the detected user action meets a preset disabling condition corresponding to the first application; or displaying, on the desktop of the terminal device, a disabled-state icon corresponding to the first application if it is detected that the first application is in a disabled state.

公开(公告)号：US20150136360A1

公开(公告)日：2015-05-21

申请号：US14581573

申请日：2014-12-23

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Renzhe Zhao ,  Songlin Li

IPC: F28D9/00

CPC classification number: F28D9/0087 ,  H01L23/373 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal interface pad, includes a substrate and carbon nanowires, where the substrate has a first surface and a second surface opposite to the first surface, the carbon nanowires are disposed on both the first surface and the second surface of the substrate, and the carbon nanowires are arranged in an array. The substrate includes a flexible composite metal film, or a material of the substrate includes at least one of flexible graphite and a solder alloy, and the flexible composite metal film is a flexible metal film with a surface coated with nickel, silver or gold. The thermal interface material has high thermal conductivity, may be attachable and affixed, and is easy for industrial production and use. The embodiments of the present invention further provide a production method of a thermal interface material, which features a large production volume, low costs, and easy control of product quality.

Abstract translation: 热界面衬垫包括衬底和碳纳米线，其中衬底具有第一表面和与第一表面相对的第二表面，碳纳米线设置在衬底的第一表面和第二表面上，并且碳 纳米线排列成阵列。 所述基板包括柔性复合金属膜，或者所述基板的材料包括柔性石墨和焊料合金中的至少一种，并且所述柔性复合金属膜是表面涂覆有镍，银或金的柔性金属膜。 该热界面材料具有高导热性，可附着和固定，易于工业化生产和使用。 本发明的实施例还提供一种热界面材料的制造方法，其具有大的生产量，低成本和易于控制产品质量。