公开(公告)号：US20230270020A1

公开(公告)日：2023-08-24

申请号：US18055961

申请日：2022-11-16

Applicant: IMEC VZW

Inventor： Vadiraj Manjunath Ananthapadmanabha Rao ,  Steven Van Winckel ,  Steven Brebels

IPC: H10N60/81

CPC classification number: H10N60/81

Abstract: A package includes a metal plate and a carrier substrate mounted on the top surface thereof, which includes one or more superconducting chips mounted on the carrier substrate or configured to receive the one or more chips mounted thereon. The carrier substrate and the plate are sandwiched between the planar portions of a first and second magnetic shield structure, at least the first structure including a planar portion and a receptacle-shaped shell portion arranged above and around the chip location. The package includes one or more pillars formed of a magnetic shielding material which are clamped between the planar portions of the shield structures, wherein the one or more pillars are penetrating the carrier substrate and the metal support plate, and wherein the one or more pillars are in physical contact with both of the planar portions.

公开(公告)号：US20240297136A1

公开(公告)日：2024-09-05

申请号：US18591705

申请日：2024-02-29

Applicant: IMEC VZW

Inventor： Jaber Derakhshandeh ,  Vadiraj Manjunath Ananthapadmanabha Rao ,  Danny Wan ,  Eric Beyne ,  Kristiaan De Greve ,  Anton Potocnik

IPC: H01L23/00 ,  H10N60/01 ,  H10N60/81

CPC classification number: H01L24/11 ,  H01L24/05 ,  H01L24/13 ,  H10N60/0912 ,  H10N60/815 ,  H01L2224/0401 ,  H01L2224/11009 ,  H01L2224/11462 ,  H01L2224/13109

Abstract: Superconducting solder bumps are produced on a qubit substrate by electrodeposition. The substrate comprises qubit areas, and superconducting contact pads connected to the qubit areas. First a protection layer is formed on the substrate, and patterned so as to cover at least the qubit areas. Then one or more thin layers are deposited conformally on the patterned protection layer, the thin layers comprising at least a non-superconducting layer suitable for acting as a seed layer for the electrodeposition of the solder bumps. The seed layer is removed locally in areas which lie within the surface area of respective contact pads. This is done by producing and patterning a mask layer, so that openings are formed therein, and by removing the seed layer from the bottom of the openings. The solder bumps are formed by electrodeposition of the solder material on the bottom of the openings. After the formation of the solder bumps, the seed layer and the protection layer are removed.