公开(公告)号：US20230280208A1

公开(公告)日：2023-09-07

申请号：US18004368

申请日：2021-06-11

申请人： IMEC VZW

发明人： Jan Genoe ,  Robert Gehlhaar ,  Kristiaan De Greve

IPC分类号： G01J3/02 ,  H01L27/146 ,  G01J3/28

CPC分类号： G01J3/0216 ,  H01L27/14625 ,  G01J3/2803 ,  G01J3/2823

摘要： Example embodiments relate to detectors for detecting electromagnetic radiation. One embodiment includes a detector for detecting electromagnetic radiation spanning a range from a first wavelength to a second wavelength. The detector includes an array of funnel elements for propagating electromagnetic radiation from a second plane towards a first plane. Each of the funnel elements includes an entrance end and an exit end. The entrance ends of the array of funnel elements define the second plane. The entrance end is larger than half of the second wavelength in a medium from which the electromagnetic radiation enters the detector. The exit end is smaller than half of the first wavelength of in the medium. The detector also includes an array of photosensitive elements for detecting electromagnetic radiation incident on the array of photosensitive elements. Each funnel element is associated with a photosensitive element. The array of photosensitive elements defines the first plane.

公开(公告)号：US20240297136A1

公开(公告)日：2024-09-05

申请号：US18591705

申请日：2024-02-29

申请人： IMEC VZW

发明人： Jaber Derakhshandeh ,  Vadiraj Manjunath Ananthapadmanabha Rao ,  Danny Wan ,  Eric Beyne ,  Kristiaan De Greve ,  Anton Potocnik

IPC分类号： H01L23/00 ,  H10N60/01 ,  H10N60/81

CPC分类号： H01L24/11 ,  H01L24/05 ,  H01L24/13 ,  H10N60/0912 ,  H10N60/815 ,  H01L2224/0401 ,  H01L2224/11009 ,  H01L2224/11462 ,  H01L2224/13109

摘要： Superconducting solder bumps are produced on a qubit substrate by electrodeposition. The substrate comprises qubit areas, and superconducting contact pads connected to the qubit areas. First a protection layer is formed on the substrate, and patterned so as to cover at least the qubit areas. Then one or more thin layers are deposited conformally on the patterned protection layer, the thin layers comprising at least a non-superconducting layer suitable for acting as a seed layer for the electrodeposition of the solder bumps. The seed layer is removed locally in areas which lie within the surface area of respective contact pads. This is done by producing and patterning a mask layer, so that openings are formed therein, and by removing the seed layer from the bottom of the openings. The solder bumps are formed by electrodeposition of the solder material on the bottom of the openings. After the formation of the solder bumps, the seed layer and the protection layer are removed.