公开(公告)号：US09236275B2

公开(公告)日：2016-01-12

申请号：US13661690

申请日：2012-10-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chien-Nan Yeh ,  Chin-Hung Wang ,  Hsin-Li Lee ,  Jien-Ming Chen ,  Tzong-Che Ho ,  Li-Chi Pan

IPC: H01L29/84 ,  H01L21/56 ,  B81B7/00 ,  H04R31/00 ,  H04R19/00

CPC classification number: H01L21/56 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/005 ,  H04R31/006 ,  H04R2499/11 ,  H04R2499/15 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.

Abstract translation: 提供了一种MEMS声换能器，其包括基板，MEMS芯片和壳体。 衬底具有设置在衬底的表面上的第一开口区域和下部电极层，其中第一开口区域包括允许声压进入MEMS声学换能器的至少一个孔。 MEMS芯片设置在基板的表面上，包括第二开口区域和部分地密封第二开口区域的上电极层，其中上电极层和下电极层彼此平行并且具有间隙 之间形成感应电容器。 壳体设置在MEMS芯片或衬底的表面上，从而产生具有MEMS芯片或衬底的空腔。 此外，还提供了一种用于制造上述MEMS声换能器的方法。

公开(公告)号：US09369788B1

公开(公告)日：2016-06-14

申请号：US14586086

申请日：2014-12-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tzong-Che Ho ,  Yu-Wen Fan ,  Hong-Ren Chen ,  Chao-Ta Huang

IPC: H04R1/02 ,  B81B7/00 ,  H04R1/04 ,  H04R1/34 ,  H04R23/00

CPC classification number: H04R1/021 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H04R1/04 ,  H04R1/342 ,  H04R19/005 ,  H04R23/00 ,  H04R31/00 ,  H04R2201/003 ,  H04R2410/03 ,  H04R2499/11 ,  H01L2924/00014

Abstract: An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

Abstract translation: MEMS麦克风封装包括基板，MEMS麦克风，IC芯片和导电盖。 基板包括第一孔，上表面，底表面，侧表面，第一导电层和第二导电层。 侧表面分别连接到上表面和底表面。 第一导电层设置在上表面上。 第二导电层设置在底面上。 MEMS麦克风电耦合到基板。 IC芯片电耦合到基板。 导电盖包括第二孔。 导电盖结合到基板上以形成用于容纳MEMS麦克风和IC芯片的室。 第一孔和第二孔一起形成声孔。