公开(公告)号：US09369788B1

公开(公告)日：2016-06-14

申请号：US14586086

申请日：2014-12-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tzong-Che Ho ,  Yu-Wen Fan ,  Hong-Ren Chen ,  Chao-Ta Huang

IPC: H04R1/02 ,  B81B7/00 ,  H04R1/04 ,  H04R1/34 ,  H04R23/00

CPC classification number: H04R1/021 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H04R1/04 ,  H04R1/342 ,  H04R19/005 ,  H04R23/00 ,  H04R31/00 ,  H04R2201/003 ,  H04R2410/03 ,  H04R2499/11 ,  H01L2924/00014

Abstract: An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

Abstract translation: MEMS麦克风封装包括基板，MEMS麦克风，IC芯片和导电盖。 基板包括第一孔，上表面，底表面，侧表面，第一导电层和第二导电层。 侧表面分别连接到上表面和底表面。 第一导电层设置在上表面上。 第二导电层设置在底面上。 MEMS麦克风电耦合到基板。 IC芯片电耦合到基板。 导电盖包括第二孔。 导电盖结合到基板上以形成用于容纳MEMS麦克风和IC芯片的室。 第一孔和第二孔一起形成声孔。