公开(公告)号：US11551829B2

公开(公告)日：2023-01-10

申请号：US17466872

申请日：2021-09-03

Applicant: Industrial Technology Research Institute

Inventor： Hung-Yi Chen ,  Yen-Ching Kuo ,  Hong-Ming Dai ,  Shu-Tang Yeh ,  Wen-Lung Chen ,  Jane-Hway Liao

IPC: G09F9/30 ,  H01B7/04

Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.

公开(公告)号：US20180294202A1

公开(公告)日：2018-10-11

申请号：US15856069

申请日：2017-12-28

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Wei-Yuan Cheng ,  Cheng-Chung Lee ,  Shau-Fei Cheng ,  Wen-Lung Chen

IPC: H01L23/31 ,  H01L23/538 ,  H01L23/60 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A chip package structure and a manufacturing method thereof are provided. The chip package structure includes a frame disposed around a chip, a filling material filled in the space between the chip and the frame, and a protection layer covering the chip, the frame, and the filling material. The Young's modulus of the filling material is respectively smaller than the Young's modulus of the chip, the Young's modulus of the frame, and the Young's modulus of the protection layer.

公开(公告)号：US09547202B2

公开(公告)日：2017-01-17

申请号：US14884409

申请日：2015-10-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuo-Lung Lo ,  Wen-Lung Chen ,  Wen-Tung Wang ,  Kuo-Chang Lee

IPC: H01L27/12 ,  G02F1/1343 ,  G02F1/1368 ,  G02F1/1362

CPC classification number: G02F1/134309 ,  G02F1/134336 ,  G02F1/136213 ,  G02F1/136286 ,  G02F1/1368 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1255

Abstract: A transparent display panel includes a substrate and a pixel array. The pixel array is formed on the substrate and includes a plurality of data lines and a plurality of scan lines. The data lines and the scan lines surround a plurality of pixel regions. Each pixel region defines a transparent region and an opaque region, wherein each transparent region occupies a relative position in the corresponding pixel region and at least three relative positions successively arranged along an axial direction are different.

Abstract translation: 透明显示面板包括基板和像素阵列。 像素阵列形成在基板上，并且包括多条数据线和多条扫描线。 数据线和扫描线围绕多个像素区域。 每个像素区域限定透明区域和不透明区域，其中每个透明区域占据相应像素区域中的相对位置，并且沿轴向连续排列的至少三个相对位置不同。