公开(公告)号：US20240218188A1

公开(公告)日：2024-07-04

申请号：US18361325

申请日：2023-07-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Chen KAO ,  Meei-Yu HSU ,  Chih-Hao LIN

IPC: C09D4/00 ,  C08F212/12 ,  C08F212/34 ,  C08F216/12 ,  C08K9/06 ,  C09D7/62 ,  C09D7/63 ,  C09D125/16 ,  C09D125/18 ,  C09D129/10

CPC classification number: C09D4/00 ,  C08F212/12 ,  C08F212/34 ,  C08F216/125 ,  C08K9/06 ,  C09D7/62 ,  C09D7/63 ,  C09D125/16 ,  C09D125/18 ,  C09D129/10 ,  C08F2800/20

Abstract: An encapsulant composition and a film are provided. The encapsulant composition includes 20-45 parts by weight of a component (A), 55-80 parts by weight of a component (B) and a component (C). The total weight of the component (A) and the component (B) is 100 parts by weight, and the weight ratio of the component (C) to the component (A) is 1:100 to 5:100. The component (A) includes first compound (A-1) and second compound (A-2), the component (B) is a non-modified inorganic powder or modified inorganic powder, and the component (C) is an initiator. The first compound (A-1) has structure represented by Formula (I) or Formula (II), and the second compound (A-2) is a monoalkenyl aromatic compound




wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, a, b, c, d, e and f are as defined in the specification.

公开(公告)号：US20230212342A1

公开(公告)日：2023-07-06

申请号：US17897288

申请日：2022-08-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yi-Chun CHEN ,  Yu-Chen KAO ,  Kai-Chi CHEN

IPC: C08F283/10

CPC classification number: C08F283/10

Abstract: A resin composition and a resin film are provided. The resin composition includes a hardener and an epoxy resin monomer. The epoxy resin monomer has a structure represented by Formula (I)




wherein A is substituted or unsubstituted C6-24 arylene group, C3-16 cycloalkylene group, C3-16 heteroarylene group, C3-16 alicyclic alkylene group, or divalent C6-25 alkylaryl group; X1 and X2 are independently




Y1 and Y2 are independently substituted or unsubstituted C6-24 arylene group, and Y1 is different from Y2; and R1 is hydrogen, C1-8 alkyl group, or C1-8 alkoxy group, wherein the weight ratio of the curing agent to the epoxy resin monomer having a structure represented by Formula (I) is from 1:100 to 1:1.