公开(公告)号：US11211353B2

公开(公告)日：2021-12-28

申请号：US16507003

申请日：2019-07-09

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Abdul Rahman Mohamed ,  Siang Kuan Chua ,  Ke Yan Tean

IPC: H01L23/00

Abstract: A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.

公开(公告)号：US10325838B2

公开(公告)日：2019-06-18

申请号：US15624026

申请日：2017-06-15

Applicant: Infineon Technologies AG

Inventor： Abdul Rahman Mohamed ,  Chu Hua Goh

IPC: H01L23/00 ,  H01L23/495

Abstract: A method of fabricating a semiconductor device is disclosed. In one aspect, the method includes placing a first semiconductor chip on a carrier with the first main surface of the first semiconductor chip facing the carrier. A first layer of soft solder material is provided between the first main surface and the carrier. Heat is applied during placing so that a temperature at the first layer of soft solder material is equal to or higher than a melting temperature of the first layer of soft solder material. A second layer of soft solder material is provided between the first contact area and the second main surface. Heat is applied during placing so that a temperature at the second layer of soft solder material is equal to or higher than a melting temperature of the second layer of soft solder material. The first and second layers of soft solder material are cooled to solidify the soft solder materials.

公开(公告)号：US09196521B2

公开(公告)日：2015-11-24

申请号：US13669339

申请日：2012-11-05

Applicant: Infineon Technologies AG

Inventor： Abdul Rahman Mohamed ,  Subaramaniym Senivasan ,  Zakaria Abdullah ,  Ralf Otremba

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6838 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/75702 ,  H01L2224/75823 ,  H01L2224/8382 ,  H01L2224/8385 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49716 ,  Y10T29/49826 ,  Y10T29/53174 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.

Abstract translation: 公开了一种可调节拾取头，夹头，调节拾取头的方法和制造装置的方法。 在一个实施例中，拾取头包括具有保持器的柄和通过第一接头连接到保持器的中间体。 拾取头还包括通过第二关节连接到中间体的夹头。

公开(公告)号：US20210013171A1

公开(公告)日：2021-01-14

申请号：US16507003

申请日：2019-07-09

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Abdul Rahman Mohamed ,  Siang Kuan Chua ,  Ke Yan Tean

IPC: H01L23/00

Abstract: A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.

公开(公告)号：US20170365544A1

公开(公告)日：2017-12-21

申请号：US15624026

申请日：2017-06-15

Applicant: Infineon Technologies AG

Inventor： Abdul Rahman Mohamed ,  Chu Hua Goh

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/49517 ,  H01L23/49524 ,  H01L24/83 ,  H01L2224/83805 ,  H01L2924/014

Abstract: A method of fabricating a semiconductor device is disclosed. In one aspect, the method includes placing a first semiconductor chip on a carrier with the first main surface of the first semiconductor chip facing the carrier. A first layer of soft solder material is provided between the first main surface and the carrier. Heat is applied during placing so that a temperature at the first layer of soft solder material is equal to or higher than a melting temperature of the first layer of soft solder material. A second layer of soft solder material is provided between the first contact area and the second main surface. Heat is applied during placing so that a temperature at the second layer of soft solder material is equal to or higher than a melting temperature of the second layer of soft solder material. The first and second layers of soft solder material are cooled to solidify the soft solder materials.

公开(公告)号：US20140123454A1

公开(公告)日：2014-05-08

申请号：US13669339

申请日：2012-11-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Abdul Rahman Mohamed ,  Subaramaniym Senivasan ,  Zakaria Abdullah ,  Ralf Otremba

IPC: B23P19/00 ,  B23P11/00

CPC classification number: H01L21/6838 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/75702 ,  H01L2224/75823 ,  H01L2224/8382 ,  H01L2224/8385 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49716 ,  Y10T29/49826 ,  Y10T29/53174 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.

Abstract translation: 公开了一种可调节拾取头，夹头，调节拾取头的方法和制造装置的方法。 在一个实施例中，拾取头包括具有保持器的柄和通过第一接头连接到保持器的中间体。 拾取头还包括通过第二关节连接到中间体的夹头。