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    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS
    1.
    发明申请
    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS 审中-公开

    公开(公告)号：US20180067888A1

    公开(公告)日：2018-03-08

    申请号：US15810556

    申请日：2017-11-13

    Applicant: Inphi Corporation

    Inventor： Siddharth SHETH ,  Radhakrishnan L. NAGARAJAN

    IPC: G06F13/42

    CPC classification number: G06F13/42 ,  G06F13/364 ,  G06F13/4072 ,  G06F13/4282 ,  G06F15/7817 ,  H04L1/0003 ,  H04L25/03006

    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS
    2.
    发明申请
    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS 审中-公开

    公开(公告)号：US20180032467A1

    公开(公告)日：2018-02-01

    申请号：US15730479

    申请日：2017-10-11

    Applicant: INPHI CORPORATION

    Inventor： Siddharth SHETH ,  Radhakrishnan L. NAGARAJAN

    IPC: G06F13/42

    CPC classification number: G06F13/42 ,  G06F13/364 ,  G06F13/4072 ,  G06F13/4282 ,  G06F15/7807 ,  G06F15/7817 ,  H04L1/0003 ,  H04L25/03006 ,  H04L27/34

    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS
    3.
    发明申请
    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS 审中-公开

    公开(公告)号：US20180329852A1

    公开(公告)日：2018-11-15

    申请号：US16040817

    申请日：2018-07-20

    Applicant: INPHI CORPORATION

    Inventor： Siddharth SHETH ,  Radhakrishnan L. NAGARAJAN

    IPC: G06F13/42

    CPC classification number: G06F13/42 ,  G06F13/364 ,  G06F13/4072 ,  G06F13/4282 ,  G06F15/7807 ,  G06F15/7817 ,  H04L1/0003 ,  H04L25/03006 ,  H04L27/34

    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS
    5.
    发明申请
    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS 审中-公开

    公开(公告)号：US20180032466A1

    公开(公告)日：2018-02-01

    申请号：US15730451

    申请日：2017-10-11

    Applicant: INPHI CORPORATION

    Inventor： Siddharth SHETH ,  Radhakrishnan L. NAGARAJAN

    IPC: G06F13/42

    CPC classification number: G06F13/42 ,  G06F15/7807 ,  G06F15/7817 ,  H04L1/0003 ,  H04L25/03006

    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

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