公开(公告)号：US20160276424A1

公开(公告)日：2016-09-22

申请号：US15169665

申请日：2016-05-31

Applicant: INTEL CORPORATION

Inventor： Andreas DUEVEL ,  Telesphor KAMGAING ,  Valluri R. RAO ,  Uwe ZILLMANN

IPC: H01L49/02 ,  H01L23/48 ,  H01L27/06 ,  H01L21/768

CPC classification number: H01L28/10 ,  H01F17/0006 ,  H01F2017/002 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0688 ,  H01L27/08 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/00012

Abstract: A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.

Abstract translation: 使用导电贯穿体通孔在集成电路管芯中形成三维电感器，该穿通体通孔穿过管芯的主体并与管芯前侧上的一个或多个金属互连层接触并终止在管芯的背面 死。 在另一个实施例中，通孔通孔可以穿过设置在管芯主体中的插塞中的电介质材料。 另一方面，变压器可以通过耦合使用通孔通孔形成的多个电感器来形成。 在另一方面，三维电感器可以包括由片上金属化层的堆叠形成的导体和设置在金属化层之间的绝缘层中的导电贯通层通孔。 描述其他实施例。

公开(公告)号：US20170309700A1

公开(公告)日：2017-10-26

申请号：US15589981

申请日：2017-05-08

Applicant: INTEL CORPORATION

Inventor： Andreas DUEVEL ,  Telesphor KAMGAING ,  Valluri R. RAO ,  Uwe ZILLMANN

IPC: H01L49/02 ,  H01L21/768 ,  H01L27/06 ,  H01F17/00 ,  H01L23/522 ,  H01L23/48 ,  H01L27/08

CPC classification number: H01L28/10 ,  H01F17/0006 ,  H01F2017/002 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0688 ,  H01L27/08 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/00012

Abstract: A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.