公开(公告)号：US20170102510A1

公开(公告)日：2017-04-13

申请号：US15378786

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Donald L. FAW ,  Uri V. CUMMINGS ,  Terrence J. TRAUSCH ,  Daniel P. DALY ,  Andrew C. ALDUINO

IPC: G02B6/44 ,  G02B6/38 ,  H04Q1/02 ,  H05K7/14

CPC classification number: G02B6/4452 ,  G02B6/3897 ,  G06F1/183 ,  H04Q1/09 ,  H04Q1/13 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1492 ,  Y10T29/49906

Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.

公开(公告)号：US20210210478A1

公开(公告)日：2021-07-08

申请号：US17191615

申请日：2021-03-03

Applicant: Intel Corporation

Inventor： Susheel JADHAV ,  Juan DOMINGUEZ ,  Ankur AGRAWAL ,  Kenneth BROWN ,  Yi LI ,  Jing CHEN ,  Aditi MALLIK ,  Xiaoyu HONG ,  Thomas LILJEBERG ,  Andrew C. ALDUINO ,  Ling LIAO ,  David HUI ,  Ren-Kang CHIOU ,  Harinadh POTLURI ,  Hari MAHALINGAM ,  Lobna KAMYAB ,  Sasanka KANUPARTHI ,  Sushrutha Reddy GUJJULA ,  Saeed FATHOLOLOUMI ,  Priyanka DOBRIYAL ,  Boping XIE ,  Abiola AWUJOOLA ,  Vladimir TAMARKIN ,  Keith MEASE ,  Stephen KEELE ,  David SCHWEITZER ,  Brent ROTHERMEL ,  Ning TANG ,  Suresh POTHUKUCHI ,  Srikant NEKKANTY ,  Zhichao ZHANG ,  Kaiyuan ZENG ,  Baikuan WANG ,  Donald TRAN ,  Ravindranath MAHAJAN ,  Baris BICEN ,  Grant SMITH

IPC: H01L25/18 ,  H01L23/473 ,  H01R12/71

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20150334867A1

公开(公告)日：2015-11-19

申请号：US14236583

申请日：2014-01-15

Applicant: INTEL CORPORATION

Inventor： Donald L. FAW ,  Uri V. CUMMINGS ,  Terrence J. TRAUSCH ,  Daniel P. DALY ,  Andrew C. ALDUINO

IPC: H05K7/14

CPC classification number: G02B6/4452 ,  G02B6/3897 ,  G06F1/183 ,  H04Q1/09 ,  H04Q1/13 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1492 ,  Y10T29/49906

Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例提供了用于机架组件的技术和配置。 在一个实施例中，要布置在机架组件中的托盘可以包括具有单个滑架的多个滑架，包括一个或多个计算节点; 以及网络元件，其与所述多个滑板的滑板相耦合，并且被配置为经由光通信系统将所述滑板可通信地连接到所述齿条组件的一个或多个其它部件。 光通信系统可以包括被配置为将网络元件与机架组件通信地连接的外部光缆。 可以描述和/或要求保护其他实施例。