公开(公告)号：US20240103304A1

公开(公告)日：2024-03-28

申请号：US17954286

申请日：2022-09-27

Applicant: Intel Corporation

Inventor： Sagar SUTHRAM ,  John HECK ,  Ling LIAO ,  Mengyuan HUANG ,  Wilfred GOMES ,  Pushkar RANADE ,  Abhishek Anil SHARMA

IPC: G02F1/025

CPC classification number: G02F1/025

Abstract: Embodiments disclosed herein include a photonics module and methods of forming photonics modules. In an embodiment, the photonics module comprises a waveguide, and a modulator adjacent to the waveguide. In an embodiment, the modulator comprises a PN junction with a P-doped region and an N-doped region, where the PN junction is vertically oriented so that the P-doped region is over the N-doped region.

公开(公告)号：US20240103216A1

公开(公告)日：2024-03-28

申请号：US17954292

申请日：2022-09-27

Applicant: Intel Corporation

Inventor： Sagar SUTHRAM ,  John HECK ,  Ling LIAO ,  Mengyuan HUANG ,  Wilfred GOMES ,  Pushkar RANADE ,  Abhishek Anil SHARMA

IPC: G02B6/12 ,  H01L25/16

CPC classification number: G02B6/12004 ,  H01L25/167

Abstract: Embodiments disclosed herein include through silicon waveguides and methods of forming such waveguides. In an embodiment, a through silicon waveguide comprises a substrate, where the substrate comprises silicon. In an embodiment, a waveguide is provided through the substrate. In an embodiment, the waveguide comprises a waveguide structure. and a cladding around the waveguide structure.

公开(公告)号：US20210407909A1

公开(公告)日：2021-12-30

申请号：US17104963

申请日：2020-11-25

Applicant: Intel Corporation

Inventor： Susheel JADHAV ,  Kenneth BROWN ,  David HUI ,  Ling LIAO ,  Syed S. ISLAM

IPC: H01L23/538 ,  G02B6/42 ,  H01L25/18 ,  H01L25/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to packages that include CPUs and PICs electrically coupled via an interconnect bridge. In embodiments, the PIC are electrically coupled with the EMIB using a fan out RDL to extend reach of the PIC electrical connectors. EICs may be electrically coupled between the PIC and the interconnect bridge. The CPUs may be CPUS, graphical processing units (GPUs), field programmable gate arrays (FPGAs), or other processors. Other embodiments may be described and/or claimed.

公开(公告)号：US20220085001A1

公开(公告)日：2022-03-17

申请号：US17539088

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Suresh V. POTHUKUCHI ,  Andrew ALDUINO ,  Ravindranath V. MAHAJAN ,  Srikant NEKKANTY ,  Ling LIAO ,  Harinadh POTLURI ,  David M. BOND ,  Sushrutha Reddy GUJJULA ,  Donald Tiendung TRAN ,  David HUI ,  Vladimir TAMARKIN

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20210280566A1

公开(公告)日：2021-09-09

申请号：US16809515

申请日：2020-03-04

Applicant: Intel Corporation

Inventor： Suresh V. POTHUKUCHI ,  Andrew ALDUINO ,  Ravindranath V. MAHAJAN ,  Srikant NEKKANTY ,  Ling LIAO ,  Harinadh POTLURI ,  David M. BOND ,  Sushrutha Reddy GUJJULA ,  Donald Tiendung TRAN ,  David HUI ,  Vladimir TAMARKIN

IPC: H01L25/16 ,  H01L23/538 ,  H01L23/367 ,  H01L23/473 ,  H01L23/40 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20210210478A1

公开(公告)日：2021-07-08

申请号：US17191615

申请日：2021-03-03

Applicant: Intel Corporation

Inventor： Susheel JADHAV ,  Juan DOMINGUEZ ,  Ankur AGRAWAL ,  Kenneth BROWN ,  Yi LI ,  Jing CHEN ,  Aditi MALLIK ,  Xiaoyu HONG ,  Thomas LILJEBERG ,  Andrew C. ALDUINO ,  Ling LIAO ,  David HUI ,  Ren-Kang CHIOU ,  Harinadh POTLURI ,  Hari MAHALINGAM ,  Lobna KAMYAB ,  Sasanka KANUPARTHI ,  Sushrutha Reddy GUJJULA ,  Saeed FATHOLOLOUMI ,  Priyanka DOBRIYAL ,  Boping XIE ,  Abiola AWUJOOLA ,  Vladimir TAMARKIN ,  Keith MEASE ,  Stephen KEELE ,  David SCHWEITZER ,  Brent ROTHERMEL ,  Ning TANG ,  Suresh POTHUKUCHI ,  Srikant NEKKANTY ,  Zhichao ZHANG ,  Kaiyuan ZENG ,  Baikuan WANG ,  Donald TRAN ,  Ravindranath MAHAJAN ,  Baris BICEN ,  Grant SMITH

IPC: H01L25/18 ,  H01L23/473 ,  H01R12/71

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.